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XG8W-4041 - XG8W-xx41

XG8W-4041

Active
Omron Electronics Inc-EMC Div

CONN HEADER VERT 40POS 2.54MM

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DocumentsDatasheetXGx and XJ8 Guide+1
XG8W-4041 - XG8W-xx41

XG8W-4041

Active
Omron Electronics Inc-EMC Div

CONN HEADER VERT 40POS 2.54MM

Deep-Dive with AI

DocumentsDatasheetXGx and XJ8 Guide+1

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationXG8W-4041XG8W Series
Connector TypeHeaderHeader
Contact Finish - Mating-Gold
Contact Finish - PostTinTin, Gold
Contact Finish Thickness - Mating-0.15 µm
Contact Finish Thickness - Mating-5.9 µin
Contact Finish Thickness - Post2 çm0.15 - 2 çm
Contact Finish Thickness - Post78.7 çin5.9 - 78.7 çin
Contact Length - Mating6 mm6 mm
Contact Length - Mating0.236 in0.236 in
Contact Length - Post0.118 in0.118 in
Contact Length - Post3 mm3 mm
Contact MaterialBrass, NickelBrass, Nickel
Contact ShapeSquareSquare
Contact TypeMale PinMale Pin
Current Rating (Amps)3 A3 A
Fastening TypePush-PullPush-Pull
Insulation ColorBlackBlack
Insulation Height-6 mm
Insulation Height-0.236 in
Insulation Height [z]0.098 in0.098 in
Insulation Height [z]2.5 mm2.5 mm
Insulation MaterialPolybutylene Terephthalate (PBT), Glass FilledPolybutylene Terephthalate (PBT), Glass Filled
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole, Through Hole, Right Angle
Number of Positions4010 - 50
Number of Positions LoadedAllAll
Number of Rows22
Operating Temperature [Max]105 ░C105 ░C
Operating Temperature [Min]-55 °C-55 °C
Overall Contact Length0.453 in0.453 in
Overall Contact Length11.5 mm11.5 mm
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Row Spacing - Mating [x]2.54 mm2.54 mm
Row Spacing - Mating [x]0.1 in0.1 in
ShroudingUnshroudedUnshrouded
StyleBoard to Board, CableBoard to Board, Cable
TerminationSolderSolder
Voltage Rating300 VDC300 VDC

XG8W Series

CONN HEADER VERT 14POS 2.54MM

PartMounting TypeContact MaterialContact Length - PostContact Length - PostInsulation ColorInsulation Height [z]Insulation Height [z]ShroudingMaterial Flammability RatingStyleInsulation MaterialOperating Temperature [Max]Operating Temperature [Min]Pitch - MatingPitch - MatingRow Spacing - Mating [x]Row Spacing - Mating [x]Contact Length - MatingContact Length - MatingContact ShapeContact TypeVoltage RatingOverall Contact LengthOverall Contact LengthNumber of RowsFastening TypeNumber of Positions LoadedTerminationConnector TypeCurrent Rating (Amps)Number of PositionsContact Finish Thickness - PostContact Finish Thickness - PostContact Finish - PostContact Finish - MatingContact Finish Thickness - MatingContact Finish Thickness - MatingInsulation HeightInsulation Height
Omron Electronics Inc-EMC Div
XG8W-1441
Through Hole
Brass, Nickel
0.118 in
3 mm
Black
0.098 in
2.5 mm
Unshrouded
UL94 V-0
Board to Board, Cable
Polybutylene Terephthalate (PBT), Glass Filled
105 ░C
-55 °C
0.1 in
2.54 mm
2.54 mm
0.1 in
6 mm
0.236 in
Square
Male Pin
300 VDC
0.453 in
11.5 mm
2
Push-Pull
All
Solder
Header
3 A
14
2 çm
78.7 çin
Tin
Omron Electronics Inc-EMC Div
XG8W-1031
Through Hole
Brass, Nickel
0.118 in
3 mm
Black
0.098 in
2.5 mm
Unshrouded
UL94 V-0
Board to Board, Cable
Polybutylene Terephthalate (PBT), Glass Filled
105 ░C
-55 °C
0.1 in
2.54 mm
2.54 mm
0.1 in
6 mm
0.236 in
Square
Male Pin
300 VDC
0.453 in
11.5 mm
2
Push-Pull
All
Solder
Header
3 A
10
0.15 µm
5.9 µin
Gold
Gold
0.15 µm
5.9 µin
Omron Electronics Inc-EMC Div
XG8W-5031
Through Hole
Brass, Nickel
0.118 in
3 mm
Black
0.098 in
2.5 mm
Unshrouded
UL94 V-0
Board to Board, Cable
Polybutylene Terephthalate (PBT), Glass Filled
105 ░C
-55 °C
0.1 in
2.54 mm
2.54 mm
0.1 in
6 mm
0.236 in
Square
Male Pin
300 VDC
0.453 in
11.5 mm
2
Push-Pull
All
Solder
Header
3 A
50
0.15 µm
5.9 µin
Gold
Gold
0.15 µm
5.9 µin
Omron Electronics Inc-EMC Div
XG8W-2034
Through Hole, Right Angle
Brass, Nickel
0.118 in
3 mm
Black
Unshrouded
UL94 V-0
Board to Board, Cable
Polybutylene Terephthalate (PBT), Glass Filled
105 ░C
-55 °C
0.1 in
2.54 mm
2.54 mm
0.1 in
6 mm
0.236 in
Square
Male Pin
300 VDC
2
Push-Pull
All
Solder
Header
3 A
20
0.15 µm
5.9 µin
Gold
Gold
0.15 µm
5.9 µin
6 mm
0.236 in
Omron Electronics Inc-EMC Div
XG8W-2631
Through Hole
Brass, Nickel
0.118 in
3 mm
Black
0.098 in
2.5 mm
Unshrouded
UL94 V-0
Board to Board, Cable
Polybutylene Terephthalate (PBT), Glass Filled
105 ░C
-55 °C
0.1 in
2.54 mm
2.54 mm
0.1 in
6 mm
0.236 in
Square
Male Pin
300 VDC
0.453 in
11.5 mm
2
Push-Pull
All
Solder
Header
3 A
26
0.15 µm
5.9 µin
Gold
Gold
0.15 µm
5.9 µin
Omron Electronics Inc-EMC Div
XG8W-4041
Through Hole
Brass, Nickel
0.118 in
3 mm
Black
0.098 in
2.5 mm
Unshrouded
UL94 V-0
Board to Board, Cable
Polybutylene Terephthalate (PBT), Glass Filled
105 ░C
-55 °C
0.1 in
2.54 mm
2.54 mm
0.1 in
6 mm
0.236 in
Square
Male Pin
300 VDC
0.453 in
11.5 mm
2
Push-Pull
All
Solder
Header
3 A
40
2 çm
78.7 çin
Tin
Omron Electronics Inc-EMC Div
XG8W-3431
Through Hole
Brass, Nickel
0.118 in
3 mm
Black
0.098 in
2.5 mm
Unshrouded
UL94 V-0
Board to Board, Cable
Polybutylene Terephthalate (PBT), Glass Filled
105 ░C
-55 °C
0.1 in
2.54 mm
2.54 mm
0.1 in
6 mm
0.236 in
Square
Male Pin
300 VDC
0.453 in
11.5 mm
2
Push-Pull
All
Solder
Header
3 A
34
0.15 µm
5.9 µin
Gold
Gold
0.15 µm
5.9 µin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 100$ 1.78

Description

General part information

XG8W Series

Connector Header Through Hole 40 position 0.100" (2.54mm)