XG8W-5031

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Omron Electronics Inc-EMC Div

CONN HEADER VERT 50POS 2.54MM

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DocumentsXGx and XJ8 Guide Datasheet +1

XG8W-5031

Active

Omron Electronics Inc-EMC Div

CONN HEADER VERT 50POS 2.54MM

Deep-Dive with AI

DocumentsXGx and XJ8 Guide Datasheet +1

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 3.55
		10	$ 3.22
		100	$ 2.84
		1000	$ 2.06
		5000	$ 1.84

Description

General part information

XG8W Series

Connector Header Through Hole 50 position 0.100" (2.54mm)

Documents

Technical documentation and resources

XGx and XJ8 Guide

Datasheet

How to Read Date Codes

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	XG8W-5031	XG8W Series

Connector Type	Header	Header
Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Tin, Gold
Contact Finish Thickness - Mating	0.15 µm	0.15 µm
Contact Finish Thickness - Mating	5.9 µin	5.9 µin
Contact Finish Thickness - Post	0.15 µm	0.15 - 2 çm
Contact Finish Thickness - Post	5.9 µin	5.9 - 78.7 çin
Contact Length - Mating	6 mm	6 mm
Contact Length - Mating	0.236 in	0.236 in
Contact Length - Post	0.118 in	0.118 in
Contact Length - Post	3 mm	3 mm
Contact Material	Brass, Nickel	Brass, Nickel
Contact Shape	Square	Square
Contact Type	Male Pin	Male Pin
Current Rating (Amps)	3 A	3 A
Fastening Type	Push-Pull	Push-Pull
Insulation Color	Black	Black
Insulation Height	-	6 mm
Insulation Height	-	0.236 in
Insulation Height [z]	0.098 in	0.098 in
Insulation Height [z]	2.5 mm	2.5 mm
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Through Hole, Right Angle
Number of Positions	50	10 - 50
Number of Positions Loaded	All	All
Number of Rows	2	2
Operating Temperature [Max]	105 ░C	105 ░C
Operating Temperature [Min]	-55 °C	-55 °C
Overall Contact Length	0.453 in	0.453 in
Overall Contact Length	11.5 mm	11.5 mm
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Row Spacing - Mating [x]	2.54 mm	2.54 mm
Row Spacing - Mating [x]	0.1 in	0.1 in
Shrouding	Unshrouded	Unshrouded
Style	Board to Board, Cable	Board to Board, Cable
Termination	Solder	Solder
Voltage Rating	300 VDC	300 VDC

XG8W Series

CONN HEADER VERT 14POS 2.54MM

Part	Mounting Type	Contact Material	Contact Length - Post	Contact Length - Post	Insulation Color	Insulation Height [z]	Insulation Height [z]	Shrouding	Material Flammability Rating	Style	Insulation Material	Operating Temperature [Max]	Operating Temperature [Min]	Pitch - Mating	Pitch - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Mating	Contact Length - Mating	Contact Shape	Contact Type	Voltage Rating	Overall Contact Length	Overall Contact Length	Number of Rows	Fastening Type	Number of Positions Loaded	Termination	Connector Type	Current Rating (Amps)	Number of Positions	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height	Insulation Height
Omron Electronics Inc-EMC Div XG8W-1441	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	14	2 çm	78.7 çin	Tin
Omron Electronics Inc-EMC Div XG8W-1031	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	10	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8W-5031	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	50	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8W-2034	Through Hole, Right Angle	Brass, Nickel	0.118 in	3 mm	Black			Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC			2	Push-Pull	All	Solder	Header	3 A	20	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin	6 mm	0.236 in
Omron Electronics Inc-EMC Div XG8W-2631	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	26	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8W-4041	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	40	2 çm	78.7 çin	Tin
Omron Electronics Inc-EMC Div XG8W-3431	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	34	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin