XG8W Series

Manufacturer: Omron Electronics Inc-EMC Div

Catalog

CONN HEADER VERT 14POS 2.54MM

Part	Mounting Type	Contact Material	Contact Length - Post	Contact Length - Post	Insulation Color	Insulation Height [z]	Insulation Height [z]	Shrouding	Material Flammability Rating	Style	Insulation Material	Operating Temperature [Max]	Operating Temperature [Min]	Pitch - Mating	Pitch - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Mating	Contact Length - Mating	Contact Shape	Contact Type	Voltage Rating	Overall Contact Length	Overall Contact Length	Number of Rows	Fastening Type	Number of Positions Loaded	Termination	Connector Type	Current Rating (Amps)	Number of Positions	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height	Insulation Height
Omron Electronics Inc-EMC Div XG8W-1441	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	14	2 çm	78.7 çin	Tin
Omron Electronics Inc-EMC Div XG8W-1031	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	10	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8W-5031	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	50	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8W-2034	Through Hole, Right Angle	Brass, Nickel	0.118 in	3 mm	Black			Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC			2	Push-Pull	All	Solder	Header	3 A	20	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin	6 mm	0.236 in
Omron Electronics Inc-EMC Div XG8W-2631	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	26	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin
Omron Electronics Inc-EMC Div XG8W-4041	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	40	2 çm	78.7 çin	Tin
Omron Electronics Inc-EMC Div XG8W-3431	Through Hole	Brass, Nickel	0.118 in	3 mm	Black	0.098 in	2.5 mm	Unshrouded	UL94 V-0	Board to Board, Cable	Polybutylene Terephthalate (PBT), Glass Filled	105 ░C	-55 °C	0.1 in	2.54 mm	2.54 mm	0.1 in	6 mm	0.236 in	Square	Male Pin	300 VDC	0.453 in	11.5 mm	2	Push-Pull	All	Solder	Header	3 A	34	0.15 µm	5.9 µin	Gold	Gold	0.15 µm	5.9 µin