
STM32H7A3RGT6
ActiveHIGH-PERFORMANCE AND DSP WITH DP-FPU, ARM CORTEX-M7 MCU WITH 1MBYTES OF FLASH MEMORY, 1376 KB SRAM, 280 MHZ CPU, L1 CACHE, GRAPHIC ACCELERATIONS, EXTERNAL MEMORY INTERFACES AND LARGE SET OF PERIPHERALS
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STM32H7A3RGT6
ActiveHIGH-PERFORMANCE AND DSP WITH DP-FPU, ARM CORTEX-M7 MCU WITH 1MBYTES OF FLASH MEMORY, 1376 KB SRAM, 280 MHZ CPU, L1 CACHE, GRAPHIC ACCELERATIONS, EXTERNAL MEMORY INTERFACES AND LARGE SET OF PERIPHERALS
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Technical Specifications
Parameters and characteristics for this part
| Specification | STM32H7A3RGT6 |
|---|---|
| Connectivity | MDIO, IrDA, SPDIF, MMC/SD/SDIO, LINbus, CANbus, EBI/EMI, UART/USART, USB OTG, SWPMI, SAI, SPI, QSPI, I2C |
| Core Processor | ARM® Cortex®-M7 |
| Core Size | 32-Bit |
| Data Converters | A/D 16x8/16b Sigma-Delta, D/A 3x12b |
| Mounting Type | Surface Mount |
| Number of I/O | 49 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | External, Internal |
| Package / Case | 64-LQFP |
| Peripherals | WDT, I2S, Brown-out Detect/Reset, POR, PWM, LCD, DMA |
| Program Memory Size | 1 MB |
| Program Memory Type | FLASH |
| RAM Size | 1.4 M |
| Speed | 280 MHz |
| Supplier Device Package | 64-LQFP (10x10) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.62 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 960 | $ 7.58 | |
Description
General part information
STM32H7A3AG Series
STM32H7A3xI/G devices are based on the high-performance Arm®Cortex®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex®-M7 core features a floating point unit (FPU) which supports Arm®double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H7A3xI/G devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.
STM32H7A3xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory up to 2 Mbytes, around 1.4 Mbyte of RAM (including 192 Kbytes of TCM RAM, 1.18 Mbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to four APB buses, three AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.
All the devices offer two ADCs, two DACs (one dual and one single DAC), two ultra-low power comparators, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, three low-power timers, a true random number generator (RNG). The devices support nine digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
Documents
Technical documentation and resources