STM32H7A3AG Series
High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1MBytes of Flash memory, 1376 KB SRAM, 280 MHz CPU, L1 cache, graphic accelerations, external memory interfaces, SMPS and large set of peripherals
Manufacturer: STMicroelectronics
Catalog
High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1MBytes of Flash memory, 1376 KB SRAM, 280 MHz CPU, L1 cache, graphic accelerations, external memory interfaces, SMPS and large set of peripherals
| Part | Core Processor | Package / Case | Mounting Type | Connectivity | Supplier Device Package | Speed | Data Converters | Peripherals | Program Memory Size | Program Memory Type | Oscillator Type | Number of I/O | Core Size | RAM Size | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics | ARM® Cortex®-M7 | 169-UFBGA | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MDIO MMC/SD/SDIO QSPI SAI SPDIF SPI SWPMI UART/USART USB OTG | 169-UFBGA (7x7) | 280 MHz | A/D 24x8/16b Sigma-Delta D/A 3x12b | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 1 MB | FLASH | External Internal | 121 | 32-Bit | 1.4 M | 3.6 V | 1.62 V | 85 °C | -40 °C |
STMicroelectronics | ARM® Cortex®-M7 | 225-TFBGA | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MDIO MMC/SD/SDIO QSPI SAI SPDIF SPI SWPMI UART/USART USB OTG | 225-TFBGA (13x13) | 280 MHz | A/D 24x8/16b Sigma-Delta D/A 3x12b | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 1 MB | FLASH | External Internal | 168 I/O | 32-Bit | 1.4 M | 3.6 V | 1.62 V | 85 °C | -40 °C |
STMicroelectronics | ARM® Cortex®-M7 | 144-LQFP | Surface Mount | CANbus EBI/EMI HDMI-CEC I2C IrDA LINbus MDIO MMC/SD/SDIO SAI SPDIF SPI SWPMI UART/USART USB OTG | 144-LQFP (20x20) | 280 MHz | A/D 20x16b D/A 3x12b | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 2 MB | FLASH | Internal | 97 | 32-Bit Single-Core | 1.4 M | 3.6 V | 1.62 V | 85 °C | -40 °C |
STMicroelectronics | ARM® Cortex®-M7 | 64-LQFP | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MDIO MMC/SD/SDIO QSPI SAI SPDIF SPI SWPMI UART/USART USB OTG | 64-LQFP (10x10) | 280 MHz | A/D 16x8/16b Sigma-Delta D/A 3x12b | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 1 MB | FLASH | External Internal | 49 | 32-Bit | 1.4 M | 3.6 V | 1.62 V | 85 °C | -40 °C |
STMicroelectronics | ARM® Cortex®-M7 | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MDIO MMC/SD/SDIO QSPI SAI SPDIF SPI SWPMI UART/USART USB OTG | 100-TFBGA (8x8) | 280 MHz | A/D 16x8/16b Sigma-Delta D/A 3x12b | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 1 MB | FLASH | External Internal | 75 I/O | 32-Bit | 1.4 M | 3.6 V | 1.62 V | 85 °C | -40 °C | |
STMicroelectronics | ARM® Cortex®-M7 | 225-TFBGA | Surface Mount | CANbus EBI/EMI HDMI-CEC I2C IrDA LINbus MDIO MMC/SD/SDIO SAI SPDIF SPI SWPMI UART/USART USB OTG | 225-TFBGA (13x13) | 280 MHz | A/D 24x16b D/A 3x12b | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 2 MB | FLASH | Internal | 168 I/O | 32-Bit Single-Core | 1.4 M | 3.6 V | 1.62 V | 85 °C | -40 °C |
Key Features
• Core
- 32-bit Arm®Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded Flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
- Up to 2 Mbytes of Flash memory with read while write support, plus 1 Kbyte of OTP
- ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
- 2x Octo-SPI memory interfaces with on-the-fly decryption, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/Flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode
- Flexible external memory controller with up to 32-bit data bus:SRAM, PSRAM, NOR Flash memory clocked up to 125 MHz in Synchronous modeSDRAM/LPSDR SDRAM,8/16-bit NAND Flash memory
- CRC calculation unit
• Security
- ROP, PC-ROP, active tamper, secure firmware upgrade support
• General-purpose input/outputs
- Up to 168 I/O ports with interrupt capabilityFast I/Os capable of up to 133 MHzUp to 164 5 V-tolerant I/Os
• Low-power consumption
- Stop: down to 32 µA with full RAM retention
- Standby: 2.8 µA (Backup SRAM OFF, RTC/LSE ON, PDR OFF)
- VBAT: 0.8 µA with RTC and LSE ON
• Clock management
- Internal oscillators: 64 MHz HSI, 48 MHz RC, 4 MHz CSI, 32 kHz LSI
- External oscillators: 4-50 MHz HSE, 32.768 kHz LSE
- 3× PLLs (1 for the system clock, 2 for kernel clocks) with fractional mode
• Reset and power management
- 2 separate power domains, which can be independently clock gated to maximize power efficiency:CPU domain (CD) for Arm®Cortex®core and its peripherals , which can be independently switched in Retention modemart run domain (SRD) for reset and clock control, power management and some peripherals
- 1.62 to 3.6 V application supply and I/Os
- POR, PDR, PVD and BOR
- Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
- Dedicated MMC power supply
- High power efficiency SMPS step-down converter regulator to directly supply VCOREor an external circuitry
- Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry
- Voltage scaling in Run and Stop mode
- Backup regulator (~0.9 V)
- Low-power modes: Sleep, Stop and Standby
- VBATbattery operating mode with charging capability
- CPU and domain power state monitoring pins
• 5 DMA controllers to unload the CPU
- 1× high-speed general-purpose master direct memory access controller (MDMA)
- 2× dual-port DMAs with FIFO and request router capabilities
- 1× basic DMA with request router capabilities
- 1x basic DMA dedicated to DFSDM
Description
AI
STM32H7A3xI/G devices are based on the high-performance Arm®Cortex®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex®-M7 core features a floating point unit (FPU) which supports Arm®double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H7A3xI/G devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.
STM32H7A3xI/G devices incorporate high-speed embedded memories with a dual-bank Flash memory up to 2 Mbytes, around 1.4 Mbyte of RAM (including 192 Kbytes of TCM RAM, 1.18 Mbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to four APB buses, three AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.
All the devices offer two ADCs, two DACs (one dual and one single DAC), two ultra-low power comparators, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, three low-power timers, a true random number generator (RNG). The devices support nine digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.