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MSP430FR5994IZVW

MSP430FR5994IZVW

Active
Texas Instruments

16 MHZ MCU WITH 256KB FRAM, 8KB SRAM, LEA, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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MSP430FR5994IZVW

MSP430FR5994IZVW

Active
Texas Instruments

16 MHZ MCU WITH 256KB FRAM, 8KB SRAM, LEA, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Description

General part information

MSP430FR5994 Series

The MSP430FR599x microcontrollers (MCUs) take low power and performance to the next level with the unique low-energy accelerator (LEA) for digital signal processing. This accelerator delivers 40x the performance of Arm®Cortex®-M0+ MCUs to help developers efficiently process data using complex functions such as FFT, FIR, and matrix multiplication. Implementation requires no DSP expertise with a free optimized DSP Library available. Additionally, with up to 256KB of unified memory with FRAM, these devices offer more space for advanced applications and flexibility for effortless implementation of over-the-air firmware updates.

The MSP ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing system designers to increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatile behavior of flash.

MSP430FR599x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits for the MSP430FR599x include theMSP-EXP430FR5994 LaunchPad™ development kitand theMSP-TS430PN80B 80-pin target development board. TI also provides freeMSP430Ware™ software, which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR5994IZVW
A/D Channels20 count
A/D Resolution (bits)12 bit
ConnectivityUART, SPI, USART, I2C, IrDA
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O68
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal, External
Package / Case87-VFBGA
Package Length6 mm
Package Name87-NFBGA
Package Width6 mm
PeripheralsPWM, POR, Reset, WDT, Brown-out Detect, DMA
Program Memory Depth256 K
Program Memory Size256 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth8 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP430FR58,59,68,69xx User Guide
Random Number Generation Using MSP430FR59xx and MSP430FR69xx Microcontrollers
MSP430 FRAM Quality and Reliability (Rev. A)
System-Level Tamper Protection Using MSP MCUs
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
How to Use MSP430 and MSP432 eUSCI and USCI Modules in RS-485 Networks
Low-Energy Accelerator (LEA) Common Parameter Blocks Reference Guide
TI-RTOS 2.20 for MSP43x Getting Started Guide (Rev. E)
Visualizing the performance of the low-energy accelerator
MSP430 System-Level ESD Considerations (Rev. B)
Setting a new standard for MCU performance while minimizing energy consumption
Sense, measure and more with MSP430™ MCUs at embedded world 2017
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
Low-Energy Accelerator (LEA) Frequently Asked Questions (FAQ)
Smart sensing with ultra-low-power MCUs – part 4: Holter monitor
MSP430 MCUs Development Guide Book (Rev. A)
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)
Low-Energy Accelerator (LEA) Commands Reference Guide
Smart sensing with ultra-low-power MCUs – part 3: ultrasonic sensing in condition
Smart sensing with ultra-low-power MCUs – part 2: smart fault indicators
Low-Energy Accelerator (LEA) Registers Reference Guide
Celebrating #MSP430love
Smart sensing with ultra-low-power MCUs – part 6: ultrasonic chirp sonar
Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
Smart sensing with ultra-low-power MCUs – part 1: glass break detectors
Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
ESD Diode Current Specification (Rev. B)
Protecting your software investment
MSP430 System ESD Troubleshooting Guide
Smart Fault Indicator with MSP430 FRAM Microcontrollers
MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
Optimizing Active Mode Current Consumption on MSP Devices
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)
Building your application with security in mind (Rev. E)
How to create your own low-power telemetry logger for a drone
MSP430FR599x, MSP430FR596x Mixed-Signal Microcontrollers datasheet (Rev. D)
MSP430FR5994 Microcontroller Errata (Rev. O)
Benchmarking the Signal Processing Capabilities of the Low-Energy Accelerator (Rev. B)
Smart sensing with ultra-low-power MCUs – part 5: smart microphones
Cities grow smarter through innovative semiconductor technologies
MSP430FRBoot – Main Memory Bootloader and Over-the-Air Updates for MSP430 FRAM (Rev. E)
How to get more processing without sacrificing power consumption
MSP Code Protection Features
Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)