Connectors, Interconnects

25-0503-31

Active

CONN SOCKET SIP 25POS GOLD

Connectors, Interconnects

Active

CONN SOCKET SIP 25POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	25-0503-31

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Current Rating	3 A
Grid Columns	25
Grid Rows	1
Housing Material	Nylon, Polyamide, Glass Filled, PA
Material Flammability Rating	UL94 HB
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	25
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.5 in
Type	SIP

Part	Pitch - Mating	Housing Material	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Termination	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish - Post	Pitch - Post	Type	Contact Material - Mating	Contact Finish - Mating	Mounting Type	Material Flammability Rating	Termination Post Length	Current Rating
Aries Electronics 25-0503-30	0.1 in	Glass Filled Nylon PA Polyamide	1	25	25	Wire Wrap	Brass	30 µin	200 µin	Tin	0.1 in	SIP	Beryllium Copper	Gold	Through Hole	UL94 HB	0.5 in	3 A
Aries Electronics 25-0503-31	0.1 in	Glass Filled Nylon PA Polyamide	1	25	25	Wire Wrap	Brass	30 µin	10 µin	Gold	0.1 in	SIP	Beryllium Copper	Gold	Through Hole	UL94 HB	0.5 in	3 A
Aries Electronics 25-0503-20	0.1 in	Glass Filled Nylon PA Polyamide	1	25	25	Wire Wrap	Brass	30 µin	200 µin	Tin	0.1 in	SIP	Beryllium Copper	Gold	Through Hole	UL94 HB	0.36 in	3 A

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$	Updated

Digikey	Bulk	22	$ 18.19	<6d

3D models and CAD resources for this part

General part information

25 (1 x 25) Pos SIP Socket Gold Through Hole

Technical documentation and resources