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CC1354P106T0RSKR

CC1354P106T0RSKR

Active
Texas Instruments

SIMPLELINK™ ARM® CORTEX®-M33 MULTIBAND WIRELESS MCU WITH 1MB FLASH, 296KB SRAM, INTEGRATED POWER AMP

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CC1354P106T0RSKR

CC1354P106T0RSKR

Active
Texas Instruments

SIMPLELINK™ ARM® CORTEX®-M33 MULTIBAND WIRELESS MCU WITH 1MB FLASH, 296KB SRAM, INTEGRATED POWER AMP

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Description

General part information

CC1354P10 Series

The SimpleLink™CC1354P10 device is a multiprotocol and multi-band Sub-1 GHz and 2.4 GHz wireless microcontroller (MCU) supportingThread,Zigbee,Bluetooth 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN),mioty,Wi-SUN,Amazon Sidewalk,proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), andconcurrent multiprotocolthrough aDynamic Multiprotocol Manager(DMM) driver. The device is optimized for low-power wireless communications, with advanced security features and on-chip over-the-air (OAD) update capability. It enables long range and reliable communication inbuilding security systems,HVAC,smart meters,medical,wired networking,portable electronics,home theater & entertainment, andconnected peripheralsmarkets. The highlighted features of this device include:

The CC1354P10 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visitSimpleLink MCU platform.

In addition to the software compatibility, within the multi-band wireless MCUs, there is pin-to-pin compatibility from 352 kB of flash up to 1 MB of flash in the 7 × 7 mm QFN package for maximum design scalability. For more information on TIs Sub-1 GHz solutions, visitwww.ti.com/sub1ghz

Technical Specifications

Parameters and characteristics for this part

SpecificationCC1354P106T0RSKR
Current - Receiving (Max)6.9 mA
Current - Receiving (Min)5.8 mA
Current - Transmitting (Max)101 mA
Current - Transmitting (Min)7.1 mA
Data Rate (Max)2 MBaud
Frequency Range 1 (Max)351 MHz
Frequency Range 1 (Min)287 MHz
Frequency Range 2 (Max)439 MHz
Frequency Range 2 (Min)359 MHz
Frequency Range 3 (Max)527 MHz
Frequency Range 3 (Min)431 MHz
Frequency Range 4 (Max)1.054 GHz
Frequency Range 4 (Min)861 MHz
Frequency Range 5 (Max)1.315 GHz
Frequency Range 5 (Min)1.076 GHz
Frequency Range 6 (Max)2.5 GHz
Frequency Range 6 (Min)2.36 GHz
GPIO Count42
Memory Size ({type})32 kB
Memory Size (Flash)1 MB
Memory Size (RAM)32 kB
Memory Size (SRAM)32 kB
Memory TypeRAM, SRAM, Flash
Modulation4-GFSK, MSK, GFSK, 2-GFSK, DSSS, OOK
Mounting TypeSurface Mount
Operating Temperature (Max)105 °C
Operating Temperature (Min)-40 °C
Package / Case64-VFQFN Exposed Pad
Package Length8 mm
Package Name64-VQFN
Package Width8 mm
Power - Output20 dBm
ProtocolZigbee®, Bluetooth v5.3
RF Family/Standard802.15.4, Bluetooth
Sensitivity-121 dBm
Serial InterfacesI2S, UART, JTAG, GPIO, ADC, I2C, SPI, PCM, PWM
TypeTxRx + MCU
Voltage - Supply (Maximum)3.8 V
Voltage - Supply (Minimum)1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

LP-EM-CC1354P10-1 EU Declaration of Conformity (DoC) (Rev. A)
Migrating your proprietary solution to the SimpleLink™ WMCU
Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family
Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family
The "key" to security: Zigbee 3.0’s security features
CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H)
TI Bluetooth® Mesh Software Product Brief
RF PCB Simulation Cookbook
Thread and Zigbee for home and building automation
Finding Settings for New Phy’s for the CC13x0 and CC13x2 Family
SimpleLink CC131x and CC135x Family Hardware Migration Guide
4 questions to ask before choosing a Wi-SUN stack
Time Multiplexing: Concurrent Multi-standard Operation
Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs
433 to 930-MHz and 2.4-GHz BOM Tunable PCB Antenna
Antenna Impedance Measurement and Matching
Designing a building security system with the Sub-1 GHz Linux Gateway Software Dev
TI 15.4-Stack Software
Dynamic Multi-Protocol (DMM) Performance
Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs
Electronic Smart Locks: Ultra-low power and Multi-Standard operation
CC1354P10 SimpleLink Wireless MCU Device Revision B (Rev. B)
Bluetooth® Low Energy Tree Structure Network
CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E)
Low-Power ADC Solution for CC13x2 and CC26x2
Exploring Thread and Zigbee for home and building automation
Out-of-box star-network solution: TI 15.4-Stack
How TI helps expand connectivity beyond the front door with Amazon Sidewalk
Understanding security features for SimpleLink™ Zigbee CC13x2 and CC26x2 Wireles
Unlock every door with the SimpleLink™ platform
CC13x4, CC26x4 SimpleLink™ Wireless MCU Technical Reference Manual
TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A)
Connect One TI 15.4 Stack Sensor to Multiple Gateways
Single-Chip Flow Metering Solution With the CC13x2R Wireless MCUs
CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU datasheet (Rev. B)
Wireless Technologies for Solar Micro Inverters and Trackers (Rev. A)
Understanding security features for SimpleLink™ Sub-1 GHz CC13x2 MCUs
2.4-GHz, 10-dBm PA IPC for CC26x2P and CC1352P
How Wi-SUN® FAN improves connected infrastructures
Configuring Bluetooth LE devices for Direct Test Mode
Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller
LP-EM-CC1354P10-6 EU Declaration of Conformity (DoC)
Wireless MCUs Designed to Meet Complex IoT Requirements
CC1354P106T0RSKR | Datasheet