60-9513-10T

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Aries Electronics

CONN IC DIP SOCKET 60POS GOLD

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60-9513-10T

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Aries Electronics

CONN IC DIP SOCKET 60POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	60-9513-10T

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	60
Number of Positions or Pins (Grid) [custom]	30
Number of Positions or Pins (Grid) [custom]	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	22.86 mm
Type	DIP
Type	0.9 in

60-9513 Series

Part	Current Rating (Amps)	Contact Finish - Mating	Housing Material	Termination	Mounting Type	Pitch - Mating	Pitch - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Mating	Type	Type	Type	Contact Finish - Post	Contact Material - Post [custom]	Features	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post
Aries Electronics 60-9513-11H	3 A	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Through Hole	0.1 in	2.54 mm	105 ░C	-55 °C	Beryllium Copper	22.86 mm	DIP	0.9 in	Gold	Brass	Closed Frame	UL94 V-0	10 çin	0.25 çm	60	30	2	3.18 mm	0.125 in	10 çin	0.25 çm	2.54 mm	0.1 in
Aries Electronics 60-9513-10	3 A	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Through Hole	0.1 in	2.54 mm	105 ░C	-55 °C	Beryllium Copper	22.86 mm	DIP	0.9 in	Tin	Brass	Closed Frame	UL94 V-0	200 µin	5.08 µm	60	30	2	3.18 mm	0.125 in	10 çin	0.25 çm	2.54 mm	0.1 in
Aries Electronics 60-9513-11	3 A	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Through Hole	0.1 in	2.54 mm	105 ░C	-55 °C	Beryllium Copper	22.86 mm	DIP	0.9 in	Gold	Brass	Closed Frame	UL94 V-0	10 çin	0.25 çm	60	30	2	3.18 mm	0.125 in	10 çin	0.25 çm	2.54 mm	0.1 in
Aries Electronics 60-9513-10T	3 A	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Through Hole	0.1 in	2.54 mm	105 ░C	-55 °C	Beryllium Copper	22.86 mm	DIP	0.9 in	Tin	Brass	Closed Frame	UL94 V-0	200 µin	5.08 µm	60	30	2	3.18 mm	0.125 in	10 çin	0.25 çm	2.54 mm	0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	53	$ 9.17

Description

General part information

60-9513 Series

60 (2 x 30) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources