60-9513 Series

Catalog

CONN IC DIP SOCKET 60POS GOLD

Part	Current Rating (Amps)	Contact Finish - Mating	Housing Material	Termination	Mounting Type	Pitch - Mating	Pitch - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Mating	Type	Type	Type	Contact Finish - Post	Contact Material - Post [custom]	Features	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post
Aries Electronics 60-9513-11H	3 A	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Through Hole	0.1 in	2.54 mm	105 ░C	-55 °C	Beryllium Copper	22.86 mm	DIP	0.9 in	Gold	Brass	Closed Frame	UL94 V-0	10 çin	0.25 çm	60	30	2	3.18 mm	0.125 in	10 çin	0.25 çm	2.54 mm	0.1 in
Aries Electronics 60-9513-10	3 A	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Through Hole	0.1 in	2.54 mm	105 ░C	-55 °C	Beryllium Copper	22.86 mm	DIP	0.9 in	Tin	Brass	Closed Frame	UL94 V-0	200 µin	5.08 µm	60	30	2	3.18 mm	0.125 in	10 çin	0.25 çm	2.54 mm	0.1 in
Aries Electronics 60-9513-11	3 A	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Through Hole	0.1 in	2.54 mm	105 ░C	-55 °C	Beryllium Copper	22.86 mm	DIP	0.9 in	Gold	Brass	Closed Frame	UL94 V-0	10 çin	0.25 çm	60	30	2	3.18 mm	0.125 in	10 çin	0.25 çm	2.54 mm	0.1 in
Aries Electronics 60-9513-10T	3 A	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	Through Hole	0.1 in	2.54 mm	105 ░C	-55 °C	Beryllium Copper	22.86 mm	DIP	0.9 in	Tin	Brass	Closed Frame	UL94 V-0	200 µin	5.08 µm	60	30	2	3.18 mm	0.125 in	10 çin	0.25 çm	2.54 mm	0.1 in