Specification	SMD291SNLT6

Ag Composition	3 %
Composition Elements	Cu, Sn, Ag
Composition Formula	Sn96.5Ag3Cu0.5
Cu Composition	0.5 %
Form	Syringe
Form Volume	5 ml
Form Weight	0.53 oz
Melting Point (Max)	428 °F
Melting Point (Min)	422 °F
Mesh Type	6
Process	Lead Free
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Sn Composition	96.5 %
Storage/Refrigeration Temperature (Maximum)	46 °F
Storage/Refrigeration Temperature (Minimum)	37 °F
Type	Solder Paste

SMD291 Series

Part	Process	Storage/Refrigeration Temperature (Maximum)	Storage/Refrigeration Temperature (Minimum)	Mesh Type	Type	Melting Point (Max)	Melting Point (Min)	Shelf Life	Ag Composition	Composition Elements	Composition Formula	Cu Composition	Sn Composition	Form	Form Weight	Shelf Life Start	Form Volume
Chip Quik Inc. SMD291SNL50T6	Lead Free	46 °F	37 °F	6	Solder Paste	428 °F	422 °F	6 Months	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	Jar	1.76 oz	Date of Manufacture
Chip Quik Inc. SMD291SNLT6	Lead Free	46 °F	37 °F	6	Solder Paste	428 °F	422 °F	6 Months	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	Syringe	0.53 oz	Date of Manufacture	5 ml

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