SMD291 Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SOLDER PASTE IN JAR 50G (T6) SAC
| Part | Process | Storage/Refrigeration Temperature (Maximum) | Storage/Refrigeration Temperature (Minimum) | Mesh Type | Type | Melting Point (Max) | Melting Point (Min) | Shelf Life | Ag Composition | Composition Elements | Composition Formula | Cu Composition | Sn Composition | Form | Form Weight | Shelf Life Start | Form Volume |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | Lead Free | 46 °F | 37 °F | 6 | Solder Paste | 428 °F | 422 °F | 6 Months | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Jar | 1.76 oz | Date of Manufacture | |
 Chip Quik Inc. | Lead Free | 46 °F | 37 °F | 6 | Solder Paste | 428 °F | 422 °F | 6 Months | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Syringe | 0.53 oz | Date of Manufacture | 5 ml |