HMTMS-106-56-L-S-285

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Samtec Inc.

BOARD TO BOARD & MEZZANINE CONNECTORS .050" X .100" HIGH-TEMP VARIABLE POST HEIGHT MICRO TERMINAL STRIP

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HMTMS-106-56-L-S-285

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Samtec Inc.

BOARD TO BOARD & MEZZANINE CONNECTORS .050" X .100" HIGH-TEMP VARIABLE POST HEIGHT MICRO TERMINAL STRIP

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HMTMS-106-56-L-S-285

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Length - Mating	0.285 in
Contact Length - Mating	7.24 mm
Contact Length - Post	6.1 mm
Contact Length - Post [x]	0.24 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	6
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	15.88 mm
Overall Contact Length	0.625 in
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Shrouding	Unshrouded
Termination	Solder

HMTMS-106 Series

Part	Contact Material	Contact Shape	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Rows	Connector Type	Number of Positions Loaded	Shrouding	Insulation Color	Contact Finish - Mating	Mounting Type	Insulation Material	Contact Finish - Post	Overall Contact Length	Overall Contact Length	Fastening Type	Insulation Height	Insulation Height	Pitch - Mating	Pitch - Mating	Number of Positions	Operating Temperature [Min]	Operating Temperature [Max]	Contact Type	Contact Length - Mating	Contact Length - Mating	Termination	Contact Length - Post	Contact Length - Post	Contact Length - Post [x]	Contact Length - Post [x]	Number of Positions Loaded [custom]	Contact Finish Thickness - Post
Samtec Inc. HMTMS-106-25-S-S-118	Phosphor Bronze	Square	30 Áin	0.76 Ám	1	Header	All	Unshrouded	Black	Gold	Through Hole	Liquid Crystal Polymer (LCP)	Tin	8.38 mm	0.33 in	Push-Pull	0.1 in	2.54 mm	0.05 in	1.27 mm	6	-55 °C	125 °C	Male Pin	3 mm	0.118 in	Solder	2.84 mm	0.112 in
Samtec Inc. HMTMS-106-52-SM-S-205	Phosphor Bronze	Square	30 Áin	0.76 Ám	1	Header	All	Unshrouded	Black	Gold	Through Hole	Liquid Crystal Polymer (LCP)	Tin			Push-Pull	0.1 in	2.54 mm	0.05 in	1.27 mm	6	-55 °C	125 °C	Male Pin	5.21 mm	0.205 in	Solder			0.12 in	3.05 mm
Samtec Inc. HMTMS-106-55-G-S-335-002	Phosphor Bronze	Square	10 çin	0.25 çm	1	Header		Unshrouded	Black	Gold	Through Hole	Liquid Crystal Polymer (LCP)	Gold	15.5 mm	0.61 in	Push-Pull	0.1 in	2.54 mm	0.05 in	1.27 mm	6	-55 °C	125 °C	Male Pin	8.51 mm	0.335 in	Solder	4.45 mm	0.175 in			5	Flash
Samtec Inc. HMTMS-106-53-L-S-185	Phosphor Bronze	Square	10 çin	0.25 çm	1	Header	All	Unshrouded	Black	Gold	Through Hole	Liquid Crystal Polymer (LCP)	Tin	12.83 mm	0.505 in	Push-Pull	0.1 in	2.54 mm	0.05 in	1.27 mm	6	-55 °C	125 °C	Male Pin	4.7 mm	0.185 in	Solder	5.59 mm	0.22 in
Samtec Inc. HMTMS-106-56-L-S-285	Phosphor Bronze	Square	10 çin	0.25 çm	1	Header	All	Unshrouded	Black	Gold	Through Hole	Liquid Crystal Polymer (LCP)	Tin	15.88 mm	0.625 in	Push-Pull	0.1 in	2.54 mm	0.05 in	1.27 mm	6	-55 °C	125 °C	Male Pin	7.24 mm	0.285 in	Solder	6.1 mm		0.24 in
Samtec Inc. HMTMS-106-53-L-S-285	Phosphor Bronze	Square	10 çin	0.25 çm	1	Header	All	Unshrouded	Black	Gold	Through Hole	Liquid Crystal Polymer (LCP)	Tin	12.83 mm	0.505 in	Push-Pull	0.1 in	2.54 mm	0.05 in	1.27 mm	6	-55 °C	125 °C	Male Pin	7.24 mm	0.285 in	Solder			0.12 in	3.05 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 2.30
Sager	N/A	1	$ 1.72
		50	$ 1.34
		100	$ 1.08
		500	$ 0.92
		1000	$ 0.71
		2000	$ 0.64
		5000	$ 0.50
		10000	$ 0.36

Description

General part information

HMTMS-106 Series

Connector Header Through Hole 6 position 0.050" (1.27mm)

Documents

Technical documentation and resources

Datasheet

Document