TLW-108-05-G-S-01

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Samtec Inc.

LOW PROFILE .025 SQ STRIPS

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TLW-108-05-G-S-01

Active

Samtec Inc.

LOW PROFILE .025 SQ STRIPS

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TLW-108-05-G-S-01

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	Flash
Contact Length - Post	4.32 mm
Contact Length - Post	0.17 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	5.2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height [z]	0.06 in
Insulation Height [z]	1.52 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	8
Number of Positions Loaded	7
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	8.51 mm
Overall Contact Length	0.335 in
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

TLW-108 Series

Part	Style	Contact Finish - Mating	Insulation Material	Insulation Height [z]	Insulation Height [z]	Connector Type	Contact Shape	Contact Length - Post [x]	Contact Length - Post [x]	Shrouding	Contact Type	Pitch - Mating	Pitch - Mating	Mounting Type	Termination	Number of Rows	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Mating [x]	Contact Length - Mating	Contact Finish Thickness - Post	Contact Finish - Post	Insulation Color	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions	Current Rating (Amps)	Number of Positions Loaded	Fastening Type	Contact Material	Overall Contact Length	Overall Contact Length	Number of Positions Loaded	Number of Positions	Contact Length - Post	Contact Length - Post	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Insulation Height	Insulation Height
Samtec Inc. TLW-108-01-G-S-RA-07	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.098 in	2.5 mm	Header	Square	0.12 in	3.05 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole Right Angle	Solder	1	10 çin	0.25 çm	0.23 in	5.84 mm	Flash	Gold	Black	-55 °C	125 °C	8	5.2 A	7	Push-Pull	Phosphor Bronze
Samtec Inc. TLW-108-06-G-S-05	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square	0.135 in	3.43 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	1	10 çin	0.25 çm			Flash	Gold	Black	-55 °C	125 °C	8	5.2 A	7	Push-Pull	Phosphor Bronze	7.62 mm	0.3 in
Samtec Inc. TLW-108-06-T-S-07	Board to Board Cable		Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square	0.135 in	3.43 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	1						Tin	Black	-55 °C	105 ░C	8	5.2 A	7	Push-Pull	Phosphor Bronze	7.62 mm	0.3 in
Samtec Inc. TLW-108-01-F-S-LA	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.098 in	2.5 mm	Header	Square	0.12 in	3.05 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole Right Angle	Solder	1	3 µin	0.076 µm	0.23 in	5.84 mm		Tin	Black	-55 °C	125 °C	8	5.2 A		Push-Pull	Phosphor Bronze			All
Samtec Inc. TLW-108-05-F-D	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square			Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	2	3 µin	0.076 µm				Tin	Black	-55 °C	125 °C		5.2 A		Push-Pull	Phosphor Bronze	8.51 mm	0.335 in	All	16	4.32 mm	0.17 in	2.54 mm	0.1 in
Samtec Inc. TLW-108-06-T-D	Board to Board Cable		Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square	0.135 in	3.43 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	2						Tin	Black	-55 °C	105 ░C		5.2 A		Push-Pull	Phosphor Bronze	7.62 mm	0.3 in	All	16			2.54 mm	0.1 in
Samtec Inc. TLW-108-01-G-D-RA	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)			Header	Square	0.12 in	3.05 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole Right Angle	Solder	2	10 çin	0.25 çm	0.23 in	5.84 mm	Flash	Gold	Black	-55 °C	125 °C		5.2 A		Push-Pull	Phosphor Bronze			All	16			2.54 mm	0.1 in	0.197 in	5 mm
Samtec Inc. TLW-108-05-G-S-01	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square			Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	1	10 çin	0.25 çm			Flash	Gold	Black	-55 °C	125 °C	8	5.2 A	7	Push-Pull	Phosphor Bronze	8.51 mm	0.335 in			4.32 mm	0.17 in
Samtec Inc. TLW-108-01-T-S-RA	Board to Board Cable		Liquid Crystal Polymer (LCP)	0.098 in	2.5 mm	Header	Square	0.12 in	3.05 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole Right Angle	Solder	1			0.23 in	5.84 mm		Tin	Black	-55 °C	105 ░C	8	5.2 A		Push-Pull	Phosphor Bronze			All
Samtec Inc. TLW-108-05-G-S-03	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square			Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	1	10 çin	0.25 çm			Flash	Gold	Black	-55 °C	125 °C	8	5.2 A	7	Push-Pull	Phosphor Bronze	8.51 mm	0.335 in			4.32 mm	0.17 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 2.48

Description

General part information

TLW-108 Series

Connector Header Through Hole 8 position 0.100" (2.54mm)

Documents

Technical documentation and resources

No documents available