TLW-108 Series

Catalog

LOW PROFILE .025 SQ STRIPS

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post (string_set)	Number of Positions	Contact Material	Contact Finish Thickness - Mating	Contact Length - Post	Contact Length - Mating	Insulation Color	Pitch - Mating	Contact Finish - Post	Insulation Material	Style	Insulation Height	Operating Temperature (Max)	Operating Temperature (Min)	Fastening Type	Current Rating (Per Contact)	Connector Type	Contact Finish - Mating	Contact Type	Number of Positions Loaded	Number of Rows	Contact Shape	Shrouding	Termination	Mounting Type	Overall Contact Length	Number of Positions Loaded	Row Spacing - Mating
Samtec Inc. TLW-108-01-G-S-RA-07	Flash	Flash	8	Phosphor Bronze	10 µin	0.12 in	0.23 in	Black	0.1 in	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.098 in	125 °C	-55 °C	Push-Pull	5.2 A	Header	Gold	Male Pin	7	1	Square	Unshrouded	Solder	Right Angle Through Hole
Samtec Inc. TLW-108-06-G-S-05	Flash	Flash	8	Phosphor Bronze	10 µin	0.135 in	0.105 in	Black	0.1 in	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.06 in	125 °C	-55 °C	Push-Pull	5.2 A	Header	Gold	Male Pin	7	1	Square	Unshrouded	Solder	Through Hole	0.3 in
Samtec Inc. TLW-108-06-T-S-07			8	Phosphor Bronze		0.135 in	0.105 in	Black	0.1 in	Tin	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.06 in	105 °C	-55 °C	Push-Pull	5.2 A	Header	Tin	Male Pin	7	1	Square	Unshrouded	Solder	Through Hole	0.3 in
Samtec Inc. TLW-108-01-F-S-LA			8	Phosphor Bronze	3 µin	0.12 in	0.23 in	Black	0.1 in	Tin	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.098 in	125 °C	-55 °C	Push-Pull	5.2 A	Header	Gold	Male Pin		1	Square	Unshrouded	Solder	Right Angle Through Hole		All
Samtec Inc. TLW-108-06-L-S			8	Phosphor Bronze		0.135 in	0.105 in	Black	0.1 in		Liquid Crystal Polymer (LCP)	Board Board or Cable	0.06 in	125 °C	-55 °C	Push-Pull	5.2 A	Header	Gold	Male Pin		1	Square	Unshrouded	Solder	Through Hole	0.3 in	All
Samtec Inc. TLW-108-05-F-D			16	Phosphor Bronze	3 µin	0.17 in	0.105 in	Black	0.1 in	Tin	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.06 in	125 °C	-55 °C	Push-Pull	5.2 A	Header	Gold	Male Pin		2	Square	Unshrouded	Solder	Through Hole	0.335 in	All	0.1 in
Samtec Inc. TLW-108-05-G-S-04	Flash	Flash	8	Phosphor Bronze	10 µin	0.17 in	0.105 in	Black	0.1 in	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.06 in	125 °C	-55 °C	Push-Pull	5.2 A	Header	Gold	Male Pin	7	1	Square	Unshrouded	Solder	Through Hole	0.335 in
Samtec Inc. TLW-108-06-T-D			16	Phosphor Bronze		0.135 in	0.105 in	Black	0.1 in	Tin	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.06 in	105 °C	-55 °C	Push-Pull	5.2 A	Header	Tin	Male Pin		2	Square	Unshrouded	Solder	Through Hole	0.3 in	All	0.1 in
Samtec Inc. TLW-108-01-G-D-RA	Flash	Flash	16	Phosphor Bronze	10 µin	0.12 in	0.23 in	Black	0.1 in	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.197 in	125 °C	-55 °C	Push-Pull	5.2 A	Header	Gold	Male Pin		2	Square	Unshrouded	Solder	Right Angle Through Hole		All	0.1 in
Samtec Inc. TLW-108-05-G-S-01	Flash	Flash	8	Phosphor Bronze	10 µin	0.17 in	0.105 in	Black	0.1 in	Gold	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.06 in	125 °C	-55 °C	Push-Pull	5.2 A	Header	Gold	Male Pin	7	1	Square	Unshrouded	Solder	Through Hole	0.335 in