TLW-108 Series

Catalog

LOW PROFILE .025 SQ STRIPS

Part	Style	Contact Finish - Mating	Insulation Material	Insulation Height [z]	Insulation Height [z]	Connector Type	Contact Shape	Contact Length - Post [x]	Contact Length - Post [x]	Shrouding	Contact Type	Pitch - Mating	Pitch - Mating	Mounting Type	Termination	Number of Rows	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Mating [x]	Contact Length - Mating	Contact Finish Thickness - Post	Contact Finish - Post	Insulation Color	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions	Current Rating (Amps)	Number of Positions Loaded	Fastening Type	Contact Material	Overall Contact Length	Overall Contact Length	Number of Positions Loaded	Number of Positions	Contact Length - Post	Contact Length - Post	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Insulation Height	Insulation Height
Samtec Inc. TLW-108-01-G-S-RA-07	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.098 in	2.5 mm	Header	Square	0.12 in	3.05 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole Right Angle	Solder	1	10 çin	0.25 çm	0.23 in	5.84 mm	Flash	Gold	Black	-55 °C	125 °C	8	5.2 A	7	Push-Pull	Phosphor Bronze
Samtec Inc. TLW-108-06-G-S-05	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square	0.135 in	3.43 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	1	10 çin	0.25 çm			Flash	Gold	Black	-55 °C	125 °C	8	5.2 A	7	Push-Pull	Phosphor Bronze	7.62 mm	0.3 in
Samtec Inc. TLW-108-06-T-S-07	Board to Board Cable		Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square	0.135 in	3.43 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	1						Tin	Black	-55 °C	105 ░C	8	5.2 A	7	Push-Pull	Phosphor Bronze	7.62 mm	0.3 in
Samtec Inc. TLW-108-01-F-S-LA	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.098 in	2.5 mm	Header	Square	0.12 in	3.05 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole Right Angle	Solder	1	3 µin	0.076 µm	0.23 in	5.84 mm		Tin	Black	-55 °C	125 °C	8	5.2 A		Push-Pull	Phosphor Bronze			All
Samtec Inc. TLW-108-05-F-D	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square			Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	2	3 µin	0.076 µm				Tin	Black	-55 °C	125 °C		5.2 A		Push-Pull	Phosphor Bronze	8.51 mm	0.335 in	All	16	4.32 mm	0.17 in	2.54 mm	0.1 in
Samtec Inc. TLW-108-06-T-D	Board to Board Cable		Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square	0.135 in	3.43 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	2						Tin	Black	-55 °C	105 ░C		5.2 A		Push-Pull	Phosphor Bronze	7.62 mm	0.3 in	All	16			2.54 mm	0.1 in
Samtec Inc. TLW-108-01-G-D-RA	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)			Header	Square	0.12 in	3.05 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole Right Angle	Solder	2	10 çin	0.25 çm	0.23 in	5.84 mm	Flash	Gold	Black	-55 °C	125 °C		5.2 A		Push-Pull	Phosphor Bronze			All	16			2.54 mm	0.1 in	0.197 in	5 mm
Samtec Inc. TLW-108-05-G-S-01	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square			Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	1	10 çin	0.25 çm			Flash	Gold	Black	-55 °C	125 °C	8	5.2 A	7	Push-Pull	Phosphor Bronze	8.51 mm	0.335 in			4.32 mm	0.17 in
Samtec Inc. TLW-108-01-T-S-RA	Board to Board Cable		Liquid Crystal Polymer (LCP)	0.098 in	2.5 mm	Header	Square	0.12 in	3.05 mm	Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole Right Angle	Solder	1			0.23 in	5.84 mm		Tin	Black	-55 °C	105 ░C	8	5.2 A		Push-Pull	Phosphor Bronze			All
Samtec Inc. TLW-108-05-G-S-03	Board to Board Cable	Gold	Liquid Crystal Polymer (LCP)	0.06 in	1.52 mm	Header	Square			Unshrouded	Male Pin	0.1 in	2.54 mm	Through Hole	Solder	1	10 çin	0.25 çm			Flash	Gold	Black	-55 °C	125 °C	8	5.2 A	7	Push-Pull	Phosphor Bronze	8.51 mm	0.335 in			4.32 mm	0.17 in