42-6556-20

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Aries Electronics

CONN IC DIP SOCKET 42POS GOLD

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42-6556-20

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Aries Electronics

CONN IC DIP SOCKET 42POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	42-6556-20

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	42
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	7.19 mm
Termination Post Length	0.283 in
Type	DIP
Type	0.6 in
Type	15.24 mm

42-6556 Series

Part	Contact Finish - Post	Mounting Type	Contact Material - Post [custom]	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Type	Type	Type	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Housing Material	Contact Material - Mating	Contact Finish - Mating	Termination
Aries Electronics 42-6556-40	Tin	Through Hole	Brass	Open Frame	200 µin	5.08 µm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.18 in	4.57 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold
Aries Electronics 42-6556-11	Gold	Through Hole	Brass	Open Frame	10 çin	0.25 çm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.13 in	3.3 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Solder
Aries Electronics 42-6556-21	Gold	Through Hole	Brass	Open Frame	10 çin	0.25 çm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.283 in	7.19 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Wire Wrap
Aries Electronics 42-6556-41	Gold	Through Hole	Brass	Open Frame	10 çin	0.25 çm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.18 in	4.57 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold
Aries Electronics 42-6556-30	Tin	Through Hole	Brass	Open Frame	200 µin	5.08 µm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.423 in	10.74 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Wire Wrap
Aries Electronics 42-6556-20	Tin	Through Hole	Brass	Open Frame	200 µin	5.08 µm	2.54 mm	0.1 in	42	DIP	0.6 in	15.24 mm	UL94 V-0	30 Áin	0.76 Ám	0.1 in	2.54 mm	0.283 in	7.19 mm	3 A	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	Wire Wrap

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	25	$ 15.80

Description

General part information

42-6556 Series

42 (2 x 21) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources