42-6556 Series

Catalog

CONN IC DIP SOCKET 42POS GOLD

Part	Material Flammability Rating	Termination Post Length	Current Rating	Contact Finish - Post	Termination	Features	Contact Finish - Mating	Contact Material - Mating	Pitch - Mating	Contact Finish Thickness - Post	Row Spacing	Type	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Housing Material	Pitch - Post	Contact Finish Thickness - Mating	Contact Material - Post	Mounting Type
Aries Electronics 42-6556-40	UL94 V-0	0.18 in	3 A	Tin	Solder Cup	Open Frame	Gold	Beryllium Copper	0.1 in	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	42	21	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	30 µin	Brass	Through Hole
Aries Electronics 42-6556-31	UL94 V-0	0.423 in	3 A	Gold	Wire Wrap	Open Frame	Gold	Beryllium Copper	0.1 in	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	42	21	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	30 µin	Brass	Through Hole
Aries Electronics 42-6556-11	UL94 V-0	0.13 in	3 A	Gold	Solder	Open Frame	Gold	Beryllium Copper	0.1 in	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	42	21	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	30 µin	Brass	Through Hole
Aries Electronics 42-6556-21	UL94 V-0	0.283 in	3 A	Gold	Wire Wrap	Open Frame	Gold	Beryllium Copper	0.1 in	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	42	21	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	30 µin	Brass	Through Hole
Aries Electronics 42-6556-41	UL94 V-0	0.18 in	3 A	Gold	Solder Cup	Open Frame	Gold	Beryllium Copper	0.1 in	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	42	21	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	30 µin	Brass	Through Hole
Aries Electronics 42-6556-10	UL94 V-0	0.13 in	3 A	Tin	Solder	Open Frame	Gold	Beryllium Copper	0.1 in	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	42	21	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	30 µin	Brass	Through Hole
Aries Electronics 42-6556-30	UL94 V-0	0.423 in	3 A	Tin	Wire Wrap	Open Frame	Gold	Beryllium Copper	0.1 in	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	42	21	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	30 µin	Brass	Through Hole
Aries Electronics 42-6556-20	UL94 V-0	0.283 in	3 A	Tin	Wire Wrap	Open Frame	Gold	Beryllium Copper	0.1 in	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	42	21	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	30 µin	Brass	Through Hole