Specification	A2F200M3F-FGG256I

Architecture	FPGA, MCU
Connectivity	EMI, UART, Ethernet, EBI, SPI, USART, I2C
Core Processor	ARM® Cortex®-M3
Flash Size	256 KB
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	256-LBGA
Package Length	17 mm
Package Name	256-FPBGA
Package Width	17 mm
Peripherals	WDT, POR, DMA
Primary Attributes	ProASIC®3 FPGA, 4608 D-Flip-Flops, 200K Gates
RAM Size	64 KB
Speed	80 MHz

A2F200M3F Series

Ultra Low Density Devices with hard ARM Cortex-M3

Part	Operating Temperature (Max)	Operating Temperature (Min)	Package Name	Package Length	Package Width	RAM Size	Package / Case	Speed	Peripherals	Flash Size	Architecture	Connectivity	Core Processor	Primary Attributes
Microchip Technology A2F200M3F-1CSG288	85 °C	0 °C	288-CSP	11 mm	11 mm	64 KB	288-TFBGA CSPBGA	100 MHz	DMA POR WDT	256 KB	FPGA MCU	EBI EMI Ethernet I2C SPI UART USART	ARM® Cortex®-M3	200K Gates 4608 D-Flip-Flops ProASIC®3 FPGA
Microchip Technology A2F200M3F-1FGG484I	100 °C	-40 °C	484-FPBGA	23 mm	23 mm	64 KB	484-BGA	100 MHz	DMA POR WDT	256 KB	FPGA MCU	EBI EMI Ethernet I2C SPI UART USART	ARM® Cortex®-M3	200K Gates 4608 D-Flip-Flops ProASIC®3 FPGA
Microchip Technology A2F200M3F-1FG484	85 °C	0 °C	484-FPBGA	23 mm	23 mm	64 KB	484-BGA	100 MHz	DMA POR WDT	256 KB	FPGA MCU	EBI EMI Ethernet I2C SPI UART USART	ARM® Cortex®-M3	200K Gates 4608 D-Flip-Flops ProASIC®3 FPGA
Microchip Technology A2F200M3F-FGG256I	100 °C	-40 °C	256-FPBGA	17 mm	17 mm	64 KB	256-LBGA	80 MHz	DMA POR WDT	256 KB	FPGA MCU	EBI EMI Ethernet I2C SPI UART USART	ARM® Cortex®-M3	200K Gates 4608 D-Flip-Flops ProASIC®3 FPGA

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources