A2F200M3F Series

Ultra Low Density Devices with hard ARM Cortex-M3

Catalog

Ultra Low Density Devices with hard ARM Cortex-M3

Part	Operating Temperature (Max)	Operating Temperature (Min)	Package Name	Package Length	Package Width	RAM Size	Package / Case	Speed	Peripherals	Flash Size	Architecture	Connectivity	Core Processor	Primary Attributes
Microchip Technology A2F200M3F-1CSG288	85 °C	0 °C	288-CSP	11 mm	11 mm	64 KB	288-TFBGA CSPBGA	100 MHz	DMA POR WDT	256 KB	FPGA MCU	EBI EMI Ethernet I2C SPI UART USART	ARM® Cortex®-M3	200K Gates 4608 D-Flip-Flops ProASIC®3 FPGA
Microchip Technology A2F200M3F-1FGG484I	100 °C	-40 °C	484-FPBGA	23 mm	23 mm	64 KB	484-BGA	100 MHz	DMA POR WDT	256 KB	FPGA MCU	EBI EMI Ethernet I2C SPI UART USART	ARM® Cortex®-M3	200K Gates 4608 D-Flip-Flops ProASIC®3 FPGA
Microchip Technology A2F200M3F-1FG484	85 °C	0 °C	484-FPBGA	23 mm	23 mm	64 KB	484-BGA	100 MHz	DMA POR WDT	256 KB	FPGA MCU	EBI EMI Ethernet I2C SPI UART USART	ARM® Cortex®-M3	200K Gates 4608 D-Flip-Flops ProASIC®3 FPGA
Microchip Technology A2F200M3F-FGG256I	100 °C	-40 °C	256-FPBGA	17 mm	17 mm	64 KB	256-LBGA	80 MHz	DMA POR WDT	256 KB	FPGA MCU	EBI EMI Ethernet I2C SPI UART USART	ARM® Cortex®-M3	200K Gates 4608 D-Flip-Flops ProASIC®3 FPGA

Catalog

Ultra Low Density Devices with hard ARM Cortex-M3

Description

SmartFusion® System on Chip (SoC) FPGAs are the only devices that integrate an FPGA fabric, ARM Cortex-M3 Processor, and programmable analog circuitry, offering the benefits of full customization and IP protection, while still being easy to use. Based on a proprietary flash process, SmartFusion SoC FPGAs are ideal for hardware and embedded designers who need a true system-on-chip (SoC) solution that gives more flexibility than traditional fixed-function microcontrollers without the excessive cost of soft processor cores on traditional FPGAs.