40-6551-18

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Aries Electronics

CONN IC DIP SOCKET ZIF 40POS

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Aries Electronics

CONN IC DIP SOCKET ZIF 40POS

Technical Specifications

Parameters and characteristics for this part

Specification	40-6551-18

Contact Finish - Mating	Nickel Boron
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Mating	1.27 µm
Contact Finish Thickness - Mating	50 µin
Contact Finish Thickness - Post	1.27 µm
Contact Finish Thickness - Post	50 µin
Contact Material - Mating	Beryllium Nickel
Contact Material - Post	Beryllium Nickel
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyetheretherketone (PEEK), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Operating Temperature [Max]	250 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	15.24 mm
Type	DIP, ZIF (ZIP)
Type	0.6 "

Part	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Pitch - Post	Pitch - Post	Current Rating (Amps)	Type	Type	Type	Features	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Housing Material	Contact Material - Post	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 40-6551-10	Beryllium Copper	5.08 µm	200 µin	Tin	2.54 mm	0.1 in	1 A	15.24 mm	DIP ZIF (ZIP)	0.6 "	Closed Frame	40	20	2	UL94 V-0	0.11 in	2.78 mm	200 µin	5.08 µm	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Solder	0.1 in	2.54 mm
Aries Electronics 40-6551-18	Beryllium Nickel	1.27 µm	50 µin	Nickel Boron	2.54 mm	0.1 in	1 A	15.24 mm	DIP ZIF (ZIP)	0.6 "	Closed Frame	40	20	2	UL94 V-0	0.11 in	2.78 mm	50 µin	1.27 µm	Through Hole	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	Solder	0.1 in	2.54 mm	Nickel Boron	-55 °C	250 °C
Aries Electronics 40-6551-11	Beryllium Copper			Gold	2.54 mm	0.1 in	1 A	15.24 mm	DIP ZIF (ZIP)	0.6 "	Closed Frame	40	20	2	UL94 V-0	0.11 in	2.78 mm			Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Solder	0.1 in	2.54 mm	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	7	$ 114.69

General part information

40 (2 x 20) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Nickel Boron Through Hole

Technical documentation and resources

No documents available