40-6551 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Pitch - Post	Pitch - Post	Current Rating (Amps)	Type	Type	Type	Features	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Housing Material	Contact Material - Post	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 40-6551-10	Beryllium Copper	5.08 µm	200 µin	Tin	2.54 mm	0.1 in	1 A	15.24 mm	DIP ZIF (ZIP)	0.6 "	Closed Frame	40	20	2	UL94 V-0	0.11 in	2.78 mm	200 µin	5.08 µm	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Solder	0.1 in	2.54 mm
Aries Electronics 40-6551-18	Beryllium Nickel	1.27 µm	50 µin	Nickel Boron	2.54 mm	0.1 in	1 A	15.24 mm	DIP ZIF (ZIP)	0.6 "	Closed Frame	40	20	2	UL94 V-0	0.11 in	2.78 mm	50 µin	1.27 µm	Through Hole	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	Solder	0.1 in	2.54 mm	Nickel Boron	-55 °C	250 °C
Aries Electronics 40-6551-11	Beryllium Copper			Gold	2.54 mm	0.1 in	1 A	15.24 mm	DIP ZIF (ZIP)	0.6 "	Closed Frame	40	20	2	UL94 V-0	0.11 in	2.78 mm			Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Solder	0.1 in	2.54 mm	Gold