208-7391-55-1902

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CONN SOCKET SOIC 8POS GOLD

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CONN SOCKET SOIC 8POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	208-7391-55-1902

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyethersulfone (PES), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	8
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Termination	Solder
Termination Post Length	3.56 mm
Termination Post Length	0.14 in
Type	SOIC

CONN SOCKET SOIC 8POS GOLD

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish - Mating	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Mounting Type	Number of Positions or Pins (Grid)	Contact Material - Post	Termination	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]	Features
3M 208-7391-55-1902	30 Áin	0.76 Ám	Beryllium Copper	Gold	UL94 V-0	1 A	3.56 mm	0.14 in	Through Hole	8	Beryllium Copper	Solder	SOIC	30 µin	0.76 µm	Gold	Polyethersulfone (PES), Glass Filled	-55 °C	150 °C	Closed Frame

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

8 (2 x 4) Pos SOIC Socket Gold Through Hole

Technical documentation and resources