CONN SOCKET SOIC 8POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Mating | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Mounting Type | Number of Positions or Pins (Grid) | Contact Material - Post | Termination | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
30 Áin | 0.76 Ám | Beryllium Copper | Gold | UL94 V-0 | 1 A | 3.56 mm | 0.14 in | Through Hole | 8 | Beryllium Copper | Solder | SOIC | 30 µin | 0.76 µm | Gold | Polyethersulfone (PES), Glass Filled | -55 °C | 150 °C | Closed Frame |