W66BQ6NBUAGJ TR
ActiveWinbond Electronics
IC DRAM 2GBIT LVSTL 11 200WFBGA
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W66BQ6NBUAGJ TR
ActiveWinbond Electronics
IC DRAM 2GBIT LVSTL 11 200WFBGA
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W66BQ6NBUAGJ TR | W66BQ6 Series |
|---|---|---|
| Access Time | - | 3.6 ns |
| Clock Frequency | 1866 MHz | 1.6 - 1866 MHz |
| Memory Format | DRAM | DRAM |
| Memory Interface | - | LVSTL_06 |
| Memory Organization | 128 M | 128 M |
| Memory Size | 2 Gbit | 2 Gbit |
| Memory Type | Volatile | Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 105 °C | 105 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 200-WFBGA | 200-WFBGA, 200-TFBGA |
| Supplier Device Package | 200-WFBGA (10x14.5) | 200-WFBGA (10x14.5), 200-TFBGA |
| Supplier Device Package | - | 14.5 |
| Supplier Device Package | - | 10 |
| Technology | SDRAM - Mobile LPDDR4X | SDRAM - Mobile LPDDR4X |
| Voltage - Supply [Max] | 1.95 V, 1.17 V | 1.17 - 1.95 V |
| Voltage - Supply [Min] | 1.06 V, 1.7 V | 1.06 - 1.7 V |
| Write Cycle Time - Word, Page | 18 ns | 18 ns |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 2500 | $ 3.92 | |
W66BQ6 Series
IC DRAM 2GBIT LVSTL 11 200WFBGA
| Part | Clock Frequency | Operating Temperature [Max] | Operating Temperature [Min] | Memory Organization | Write Cycle Time - Word, Page | Memory Type | Memory Format | Mounting Type | Memory Size | Voltage - Supply [Min] | Voltage - Supply [Max] | Supplier Device Package | Technology | Package / Case | Memory Interface | Supplier Device Package [y] | Supplier Device Package [x] | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W66BQ6NBUAGJ | 1866 MHz | 105 °C | -40 °C | 128 M | 18 ns | Volatile | DRAM | Surface Mount | 2 Gbit | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 200-WFBGA (10x14.5) | SDRAM - Mobile LPDDR4X | 200-WFBGA | ||||
Winbond Electronics W66BQ6NBUAFJ TR | 1.6 GHz | 105 °C | -40 °C | 128 M | 18 ns | Volatile | DRAM | Surface Mount | 2 Gbit | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 200-WFBGA (10x14.5) | SDRAM - Mobile LPDDR4X | 200-WFBGA | ||||
Winbond Electronics W66BQ6NBQAGJ | 1.867 GHz | 105 °C | -40 °C | 128 M | 18 ns | Volatile | DRAM | Surface Mount | 2 Gbit | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 200-TFBGA | SDRAM - Mobile LPDDR4X | 200-TFBGA | LVSTL_06 | 14.5 | 10 | 3.6 ns |
Winbond Electronics W66BQ6NBUAFJ | 1.6 GHz | 105 °C | -40 °C | 128 M | 18 ns | Volatile | DRAM | Surface Mount | 2 Gbit | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 200-WFBGA (10x14.5) | SDRAM - Mobile LPDDR4X | 200-WFBGA | ||||
Winbond Electronics W66BQ6NBUAGJ TR | 1866 MHz | 105 °C | -40 °C | 128 M | 18 ns | Volatile | DRAM | Surface Mount | 2 Gbit | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 200-WFBGA (10x14.5) | SDRAM - Mobile LPDDR4X | 200-WFBGA | ||||
Winbond Electronics W66BQ6NBUAHJ | 2.133 GHz | 105 °C | -40 °C | 128 M | 18 ns | Volatile | DRAM | Surface Mount | 2 Gbit | 1.06 V, 1.7 V | 1.17 V, 1.95 V | 200-WFBGA (10x14.5) | SDRAM - Mobile LPDDR4X | 200-WFBGA |
Description
General part information
W66BQ6 Series
SDRAM - Mobile LPDDR4X Memory IC 2Gbit LVSTL_11 1.866 GHz 3.5 ns 200-WFBGA (10x14.5)
Documents
Technical documentation and resources