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TSSOP (DGG)

MSP430FR2032IG56R

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Texas Instruments

16 MHZ MCU WITH 8KB FRAM, 1KB SRAM, 10-BIT ADC, UART/SPI/I2C, IR LOGIC, TIMER

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TSSOP (DGG)

MSP430FR2032IG56R

Active
Texas Instruments

16 MHZ MCU WITH 8KB FRAM, 1KB SRAM, 10-BIT ADC, UART/SPI/I2C, IR LOGIC, TIMER

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Description

General part information

MSP430FR2032 Series

The TI MSP430™ family of low-power microcontrollers consists of several devices that feature different sets of peripherals targeted for various applications. The architecture, combined with extensive low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The DCO allows the device to wake up from low-power modes to active mode in less than 10 µs.

For complete module descriptions, see theMSP430FR4xx and MSP430FR2xx Family User’s Guide.

The TI MSP430™ family of low-power microcontrollers consists of several devices that feature different sets of peripherals targeted for various applications. The architecture, combined with extensive low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The DCO allows the device to wake up from low-power modes to active mode in less than 10 µs.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR2032IG56R
A/D Channels8 count
A/D Resolution (bits)10 bit
ConnectivityIrDA, USART, I2C, SPI, SCI, UART
Core ProcessorMSP430 CPU16
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O52
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package Length0.24 in
Package Name56-TSSOP, 56-TFSOP
Package Width6.1 mm
PeripheralsWDT, PWM, Brown-out Detect, POR, Reset
Program Memory Depth8.5 K
Program Memory Size8.5 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth1 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP Code Protection Features
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
Migrating from the MSP430F4xx to Family to the MSP430FR4xx Family
Infrared Remote Control Implementation With MSP430FR4xx (Rev. B)
Migrating from MSP430 F2xx and G2xx families to MSP430 FR4xx and FR2xx family (Rev. G)
Benchmarking MCU power consumption for ultra-low-power applications
VLO Calibration on the MSP430FR4xx and MSP430FR2xx Family (Rev. A)
FRAM FAQs
Designing With the MSP430FR4xx and MSP430FR2xx ADC (Rev. A)
ESD Diode Current Specification (Rev. B)
MSP430 System-Level ESD Considerations (Rev. B)
MSP430FR2032 Device Erratasheet (Rev. W)
MSP430FR203x Mixed-Signal Microcontrollers datasheet (Rev. E)
UART-to-I2C Bridge Using Low-Memory MSP430™ MCUs (Rev. A)
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
Low-Power Battery Voltage Measurement With MSP430FR MCU On-Chip VREF and ADC (Rev. B)
Smart Fault Indicator with MSP430 FRAM Microcontrollers
MSP430FR4xx and MSP430FR2xx Family User's Guide (Rev. I)
MSP430 FRAM Quality and Reliability (Rev. A)
MSP430FR4133 LaunchPad Development Kit (MSP-EXP430FR4133) User's Guide (Rev. B)
Thermostat Implementation With MSP430FR4xx Design Guide (Rev. A)
MSP430 MCUs Development Guide Book (Rev. A)
MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB)
Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)
MSP430 System ESD Troubleshooting Guide
Crypto-Bootloader - Secure In-Field Firmware Updates for Ultra-Low Power MCUs
Capacitive Touch and MSP Microcontrollers (Rev. A)
MSP430FR2xx and MSP430FR4xx DCO+FLL Application Guide
Water Meter Implementation With MSP430FR4xx Design Guide (Rev. A)
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)