
OMAP3525ECUS
ActiveTexas Instruments
IC MPU OMAP-35XX 600MHZ 423FCBGA

OMAP3525ECUS
ActiveTexas Instruments
IC MPU OMAP-35XX 600MHZ 423FCBGA
Description
General part information
OMAP3525 Series
OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
The device supports high-level operating systems (HLOSs), such as:
Technical Specifications
Parameters and characteristics for this part
| Specification | OMAP3525ECUS |
|---|---|
| Additional Interfaces | I2C, McBSP, UART, MMC/SD/SDIO, McSPI, HDQ/1-Wire |
| Bus Width | 32 Bit |
| Co-Processors/DSP | C64x+, Signal Processing, Multimedia, NEON™ SIMD |
| Core Processor | ARM® Cortex®-A8 |
| Display & Interface Controllers | LCD |
| Graphics Acceleration | Yes |
| Mounting Type | Surface Mount |
| Number of Cores | 1 Core |
| Operating Temperature (Max) | 90 °C |
| Operating Temperature (Min) | 0 °C |
| Package / Case | 423-LFBGA, FCBGA |
| Package Length | 16 mm |
| Package Name | 423-FCBGA |
| Package Width | 16 mm |
| RAM Controllers | LPDDR |
| Speed | 600 MHz |
| USB | USB 2.0, USB 1.x |
| USB 2.0 Count | 1 count |
| Voltage - I/O (Option 1) | 1.8 V |
| Voltage - I/O (Option 2) | 3 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
(Cancelled - see the B revision, create by mistake 14-may-2009) (Rev. C)
Powering OMAP35x with TPS65073x
PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II
OMAP35x Peripherals Overview Reference Guide (Rev. A)
OMAP3530/25/15/03 Applications Processor Silicon Errata (Rev. F)
Introduction to TMS320C6000 DSP Optimization
Migrating from OMAP3530 to AM37x
SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V)
Migrating from OMAP3530 to AM35x
OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles
OMAP35x Linux PSP Data Sheet
OMAP35x Technical Reference Manual (Rev. Y)
OMAP3530 and OMAP3525 Applications Processors datasheet (Rev. H)
PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I
PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)
OMAP35x 0.65mm Pitch Layout Methods (Rev. B)