24-C300-31

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Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

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24-C300-31

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Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	24-C300-31

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	24
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.04 in
Termination Post Length	1.02 mm
Type	DIP
Type	0.6 in
Type	15.24 mm

24-C300 Series

Part	Contact Finish - Post	Mounting Type	Current Rating (Amps)	Type	Type	Type	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Max]	Operating Temperature [Min]	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Contact Material - Mating	Contact Finish - Mating	Termination	Termination Post Length	Termination Post Length
Aries Electronics 24-C300-20	Tin	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	200 µin	5.08 µm	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Wire Wrap	0.04 in	1.02 mm
Aries Electronics 24-C300-21	Gold	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	10 çin	0.25 çm	125 °C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Wire Wrap	0.04 in	1.02 mm
Aries Electronics 24-C300-11	Gold	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	10 çin	0.25 çm	125 °C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Solder	0.125 in	3.18 mm
Aries Electronics 24-C300-10	Tin	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	200 µin	5.08 µm	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Solder	0.125 in	3.18 mm
Aries Electronics 24-C300-31	Gold	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	10 çin	0.25 çm	125 °C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Wire Wrap	0.04 in	1.02 mm
Aries Electronics 24-C300-00	Tin	Surface Mount	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	200 µin	5.08 µm	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Solder	0.04 in	1.02 mm
Aries Electronics 24-C300-30	Tin	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	200 µin	5.08 µm	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Wire Wrap	0.04 in	1.02 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	21	$ 20.39

Description

General part information

24-C300 Series

24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources