24-C300 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Contact Finish - Post	Mounting Type	Current Rating (Amps)	Type	Type	Type	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Max]	Operating Temperature [Min]	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Contact Material - Mating	Contact Finish - Mating	Termination	Termination Post Length	Termination Post Length
Aries Electronics 24-C300-20	Tin	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	200 µin	5.08 µm	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Wire Wrap	0.04 in	1.02 mm
Aries Electronics 24-C300-21	Gold	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	10 çin	0.25 çm	125 °C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Wire Wrap	0.04 in	1.02 mm
Aries Electronics 24-C300-11	Gold	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	10 çin	0.25 çm	125 °C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Solder	0.125 in	3.18 mm
Aries Electronics 24-C300-10	Tin	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	200 µin	5.08 µm	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Solder	0.125 in	3.18 mm
Aries Electronics 24-C300-31	Gold	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	10 çin	0.25 çm	125 °C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Wire Wrap	0.04 in	1.02 mm
Aries Electronics 24-C300-00	Tin	Surface Mount	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	200 µin	5.08 µm	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Solder	0.04 in	1.02 mm
Aries Electronics 24-C300-30	Tin	Through Hole	3 A	DIP	0.6 in	15.24 mm	Closed Frame	10 çin	0.25 çm	UL94 V-0	2.54 mm	0.1 in	24	200 µin	5.08 µm	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	0.1 in	2.54 mm	Brass	Beryllium Copper	Gold	Wire Wrap	0.04 in	1.02 mm