TFM-102-02-S-S-WT

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Samtec Inc.

CONN HEADER SMD 2POS 1.27MM

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TFM-102-02-S-S-WT

Active

Samtec Inc.

CONN HEADER SMD 2POS 1.27MM

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TFM-102-02-S-S-WT

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Length - Mating	3.33 mm
Contact Length - Mating	0.131 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	2.9 A
Fastening Type	Push-Pull
Features	Solder Retention
Insulation Color	Black
Insulation Height	5.6 mm
Insulation Height	0.22 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	2
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Shrouding	Shrouded - 4 Wall
Style	Board to Board, Cable
Termination	Solder
Voltage Rating	275 VAC

TFM-102 Series

Part	Row Spacing - Mating	Row Spacing - Mating	Contact Finish - Post	Material Flammability Rating	Fastening Type	Termination	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Shrouding	Insulation Height	Insulation Height	Contact Shape	Voltage Rating	Insulation Color	Contact Finish - Mating	Number of Rows	Style	Number of Positions	Contact Type	Connector Type	Contact Length - Mating	Contact Length - Mating	Contact Material	Number of Positions Loaded	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Features	Insulation Material	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. TFM-102-02-L-D-K-TR	0.05 in	1.27 mm	Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	15 µin	0.38 µm	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	2	Board to Board Cable	4	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Surface Mount	-55 °C	125 °C	2.9 A	Pick and Place	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-102-02-L-D-LC	0.05 in	1.27 mm	Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	15 µin	0.38 µm	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	2	Board to Board Cable	4	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Surface Mount	-55 °C	125 °C	2.9 A		Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-102-01-L-S			Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	15 µin	0.38 µm	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	1	Board to Board Cable	2	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Through Hole	-55 °C	125 °C	2.9 A		Liquid Crystal Polymer (LCP)	0.078 in	1.98 mm
Samtec Inc. TFM-102-01-L-D-A	0.05 in	1.27 mm	Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	15 µin	0.38 µm	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	2	Board to Board Cable	4	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Through Hole	-55 °C	125 °C	2.9 A	Board Guide	Liquid Crystal Polymer (LCP)	0.078 in	1.98 mm
Samtec Inc. TFM-102-02-F-S-WT-K-TR			Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	3 µin	0.076 µm	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	1	Board to Board Cable	2	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Surface Mount	-55 °C	125 °C	2.9 A	Pick and Place Solder Retention	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-102-02-L-DH	0.05 in	1.27 mm	Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	10 çin	0.25 çm	Shrouded - 4 Wall	5.72 mm	0.225 in	Square	275 VAC	Black	Gold	2	Board to Board Cable	4	Male Pin	Header	3.81 mm	0.15 in	Phosphor Bronze	All	Surface Mount Right Angle	-55 °C	125 °C	2.9 A		Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-102-02-F-S-A			Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	3 µin	0.076 µm	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	1	Board to Board Cable	2	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Surface Mount	-55 °C	125 °C	3.2 A	Board Guide	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-102-01-S-S-WT			Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	30 Áin	0.76 Ám	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	1	Board to Board Cable	2	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Through Hole	-55 °C	125 °C	2.9 A	Solder Retention	Liquid Crystal Polymer (LCP)	0.078 in	1.98 mm
Samtec Inc. TFM-102-02-S-S-WT			Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	30 Áin	0.76 Ám	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	1	Board to Board Cable	2	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Surface Mount	-55 °C	125 °C	2.9 A	Solder Retention	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-102-02-L-D	0.05 in	1.27 mm	Tin	UL94 V-0	Push-Pull	Solder	0.05 in	1.27 mm	15 µin	0.38 µm	Shrouded - 4 Wall	5.6 mm	0.22 in	Square	275 VAC	Black	Gold	2	Board to Board Cable	4	Male Pin	Header	3.33 mm	0.131 in	Phosphor Bronze	All	Surface Mount	-55 °C	125 °C	2.9 A		Liquid Crystal Polymer (LCP)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 2.99

Description

General part information

TFM-102 Series

Connector Header Surface Mount 2 position 0.050" (1.27mm)

Documents

Technical documentation and resources

No documents available