CONN HEADER SMD 4POS 1.27MM
| Part | Row Spacing - Mating | Row Spacing - Mating | Contact Finish - Post | Material Flammability Rating | Fastening Type | Termination | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Shrouding | Insulation Height | Insulation Height | Contact Shape | Voltage Rating | Insulation Color | Contact Finish - Mating | Number of Rows | Style | Number of Positions | Contact Type | Connector Type | Contact Length - Mating | Contact Length - Mating | Contact Material | Number of Positions Loaded | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Current Rating (Amps) | Features | Insulation Material | Contact Length - Post [x] | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 15 µin | 0.38 µm | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 2 | Board to Board Cable | 4 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Surface Mount | -55 °C | 125 °C | 2.9 A | Pick and Place | Liquid Crystal Polymer (LCP) | ||
Samtec Inc. | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 15 µin | 0.38 µm | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 2 | Board to Board Cable | 4 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Surface Mount | -55 °C | 125 °C | 2.9 A | Liquid Crystal Polymer (LCP) | |||
Samtec Inc. | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 15 µin | 0.38 µm | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 1 | Board to Board Cable | 2 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Through Hole | -55 °C | 125 °C | 2.9 A | Liquid Crystal Polymer (LCP) | 0.078 in | 1.98 mm | |||
Samtec Inc. | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 15 µin | 0.38 µm | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 2 | Board to Board Cable | 4 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Through Hole | -55 °C | 125 °C | 2.9 A | Board Guide | Liquid Crystal Polymer (LCP) | 0.078 in | 1.98 mm |
Samtec Inc. | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 3 µin | 0.076 µm | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 1 | Board to Board Cable | 2 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Surface Mount | -55 °C | 125 °C | 2.9 A | Pick and Place Solder Retention | Liquid Crystal Polymer (LCP) | ||||
Samtec Inc. | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 10 çin | 0.25 çm | Shrouded - 4 Wall | 5.72 mm | 0.225 in | Square | 275 VAC | Black | Gold | 2 | Board to Board Cable | 4 | Male Pin | Header | 3.81 mm | 0.15 in | Phosphor Bronze | All | Surface Mount Right Angle | -55 °C | 125 °C | 2.9 A | Liquid Crystal Polymer (LCP) | |||
Samtec Inc. | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 3 µin | 0.076 µm | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 1 | Board to Board Cable | 2 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Surface Mount | -55 °C | 125 °C | 3.2 A | Board Guide | Liquid Crystal Polymer (LCP) | ||||
Samtec Inc. | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 30 Áin | 0.76 Ám | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 1 | Board to Board Cable | 2 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Through Hole | -55 °C | 125 °C | 2.9 A | Solder Retention | Liquid Crystal Polymer (LCP) | 0.078 in | 1.98 mm | ||
Samtec Inc. | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 30 Áin | 0.76 Ám | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 1 | Board to Board Cable | 2 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Surface Mount | -55 °C | 125 °C | 2.9 A | Solder Retention | Liquid Crystal Polymer (LCP) | ||||
Samtec Inc. | 0.05 in | 1.27 mm | Tin | UL94 V-0 | Push-Pull | Solder | 0.05 in | 1.27 mm | 15 µin | 0.38 µm | Shrouded - 4 Wall | 5.6 mm | 0.22 in | Square | 275 VAC | Black | Gold | 2 | Board to Board Cable | 4 | Male Pin | Header | 3.33 mm | 0.131 in | Phosphor Bronze | All | Surface Mount | -55 °C | 125 °C | 2.9 A | Liquid Crystal Polymer (LCP) |