| Specification | Value |
|---|---|
| Clock Rate | 500 MHz |
| Interface | HPI, McASP, I2C, 10/100 Ethernet MAC, UART, McBSP |
| Mounting Type | Surface Mount |
| Non-Volatile Memory | 64 kB |
| On-Chip RAM | 96 kB |
| Operating Temperature [Max] | 125 ¯C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 376-BBGA Exposed Pad |
| Supplier Device Package | 376-BGA (23x23) |
| Type | Fixed Point |
| Voltage - Core | 1.2000000476837158 V, 1.0499999523162842 V |
| Voltage - I/O | 3.299999952316284 V, 1.7999999523162842 V |
| Specification | Value |
|---|---|
| Clock Rate | 500 MHz |
| Interface | HPI, McASP, I2C, 10/100 Ethernet MAC, UART, McBSP |
| Mounting Type | Surface Mount |
| Non-Volatile Memory | 64 kB |
| On-Chip RAM | 96 kB |
| Operating Temperature [Max] | 125 ¯C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 376-BBGA Exposed Pad |
| Supplier Device Package | 376-BGA (23x23) |
| Type | Fixed Point |
| Voltage - Core | 1.2000000476837158 V, 1.0499999523162842 V |
| Voltage - I/O | 3.299999952316284 V, 1.7999999523162842 V |