Specification	M2S090S-1FG484I

Architecture	FPGA, MCU
Connectivity	Ethernet, UART, SPI, USART, USB, CANbus, I2C
Core Processor	ARM® Cortex®-M3
Flash Size	512 KB
Logic Elements	90 K Logic Modules
Number of I/O	267
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	484-BGA
Package Length	23 mm
Package Name	484-FPBGA
Package Width	23 mm
Peripherals	SERDES, DDR, PCIe
Primary Attributes	FPGA
RAM Size	64 KB
Speed	166 MHz

M2S090S Series

Part	Number of I/O	Connectivity	Logic Elements	Primary Attributes	Architecture	Package / Case	Flash Size	Peripherals	Speed	Package Length	Package Name	Package Width	RAM Size	Operating Temperature (Max)	Operating Temperature (Min)	Core Processor
Microsemi Corporation M2S090S-1FG676I	425	CANbus Ethernet I2C SPI UART USART USB	90 K Logic Modules	FPGA	FPGA MCU	676-BGA	512 KB	DDR PCIe SERDES	166 MHz	27 mm	676-FBGA	27 mm	64 KB	100 °C	-40 °C	ARM® Cortex®-M3
Microsemi Corporation M2S090S-1FG484I	267	CANbus Ethernet I2C SPI UART USART USB	90 K Logic Modules	FPGA	FPGA MCU	484-BGA	512 KB	DDR PCIe SERDES	166 MHz	23 mm	484-FPBGA	23 mm	64 KB	100 °C	-40 °C	ARM® Cortex®-M3

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