Specification	M2S090S-1FG676I

Architecture	FPGA, MCU
Connectivity	Ethernet, UART, SPI, USART, USB, CANbus, I2C
Core Processor	ARM® Cortex®-M3
Flash Size	512 KB
Logic Elements	90 K Logic Modules
Number of I/O	425
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	676-BGA
Package Length	27 mm
Package Name	676-FBGA
Package Width	27 mm
Peripherals	SERDES, DDR, PCIe
Primary Attributes	FPGA
RAM Size	64 KB
Speed	166 MHz

M2S090S Series

Part	Number of I/O	Connectivity	Logic Elements	Primary Attributes	Architecture	Package / Case	Flash Size	Peripherals	Speed	Package Length	Package Name	Package Width	RAM Size	Operating Temperature (Max)	Operating Temperature (Min)	Core Processor
Microsemi Corporation M2S090S-1FG676I	425	CANbus Ethernet I2C SPI UART USART USB	90 K Logic Modules	FPGA	FPGA MCU	676-BGA	512 KB	DDR PCIe SERDES	166 MHz	27 mm	676-FBGA	27 mm	64 KB	100 °C	-40 °C	ARM® Cortex®-M3
Microsemi Corporation M2S090S-1FG484I	267	CANbus Ethernet I2C SPI UART USART USB	90 K Logic Modules	FPGA	FPGA MCU	484-BGA	512 KB	DDR PCIe SERDES	166 MHz	23 mm	484-FPBGA	23 mm	64 KB	100 °C	-40 °C	ARM® Cortex®-M3

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources