XG8T-1831

Active

Omron Electronics Inc-EMC Div

CONN HEADER VERT 18POS 2.54MM

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet How to Read Date Codes

XG8T-1831

Active

Omron Electronics Inc-EMC Div

CONN HEADER VERT 18POS 2.54MM

Deep-Dive with AI

DocumentsDatasheet How to Read Date Codes

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	XG8T-1831

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.15 µm
Contact Finish Thickness - Mating	5.9 µin
Contact Finish Thickness - Post	0.15 µm
Contact Finish Thickness - Post	5.9 µin
Contact Length - Mating [x]	4.3 mm
Contact Length - Mating [x]	0.169 in
Contact Length - Post	0.118 in
Contact Length - Post	3 mm
Contact Material	Brass, Nickel
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	2 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height [z]	0.098 in
Insulation Height [z]	2.5 mm
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	18
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Overall Contact Length	9.8 mm
Overall Contact Length	0.386 in
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder
Voltage Rating	300 VDC

XG8T Series

Part	Number of Positions Loaded	Current Rating (Amps)	Connector Type	Contact Type	Mounting Type	Voltage Rating	Operating Temperature [Max]	Operating Temperature [Min]	Number of Rows	Contact Finish - Post	Insulation Material	Termination	Contact Length - Post	Contact Length - Post	Number of Positions	Overall Contact Length	Overall Contact Length	Material Flammability Rating	Insulation Height [z]	Insulation Height [z]	Style	Shrouding	Contact Material	Pitch - Mating	Pitch - Mating	Contact Shape	Insulation Color	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Fastening Type	Contact Length - Mating [x]	Contact Length - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating
Omron Electronics Inc-EMC Div XG8T-1441	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	14	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-0641	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	6	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-1841	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	18	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-1831	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	18	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in	0.15 µm	5.9 µin	0.15 µm	5.9 µin	Gold
Omron Electronics Inc-EMC Div XG8T-0631	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	6	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in	0.15 µm	5.9 µin	0.15 µm	5.9 µin	Gold
Omron Electronics Inc-EMC Div XG8T-0441	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	4	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-1041	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	10	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-1241	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	12	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-0431	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	4	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in	0.15 µm	5.9 µin	0.15 µm	5.9 µin	Gold

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	200	$ 1.07