XG8T Series

Manufacturer: Omron Electronics Inc-EMC Div

Catalog

CONN HEADER VERT 14POS 2.54MM

Part	Number of Positions Loaded	Current Rating (Amps)	Connector Type	Contact Type	Mounting Type	Voltage Rating	Operating Temperature [Max]	Operating Temperature [Min]	Number of Rows	Contact Finish - Post	Insulation Material	Termination	Contact Length - Post	Contact Length - Post	Number of Positions	Overall Contact Length	Overall Contact Length	Material Flammability Rating	Insulation Height [z]	Insulation Height [z]	Style	Shrouding	Contact Material	Pitch - Mating	Pitch - Mating	Contact Shape	Insulation Color	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Fastening Type	Contact Length - Mating [x]	Contact Length - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating
Omron Electronics Inc-EMC Div XG8T-1441	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	14	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-0641	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	6	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-1841	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	18	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-1831	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	18	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in	0.15 µm	5.9 µin	0.15 µm	5.9 µin	Gold
Omron Electronics Inc-EMC Div XG8T-0631	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	6	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in	0.15 µm	5.9 µin	0.15 µm	5.9 µin	Gold
Omron Electronics Inc-EMC Div XG8T-0441	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	4	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-1041	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	10	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-1241	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Tin	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	12	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in
Omron Electronics Inc-EMC Div XG8T-0431	All	2 A	Header	Male Pin	Through Hole	300 VDC	105 ░C	-55 °C	2	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Solder	0.118 in	3 mm	4	9.8 mm	0.386 in	UL94 V-0	0.098 in	2.5 mm	Board to Board Cable	Unshrouded	Brass Nickel	0.1 in	2.54 mm	Square	Black	2.54 mm	0.1 in	Push-Pull	4.3 mm	0.169 in	0.15 µm	5.9 µin	0.15 µm	5.9 µin	Gold