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TSSOP (PW)

MSP430FR5722IPW

Active
Texas Instruments

8 MHZ MCU WITH 8KB FRAM, 1KB SRAM, COMPARATOR, UART/SPI/I2C, TIMER

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TSSOP (PW)

MSP430FR5722IPW

Active
Texas Instruments

8 MHZ MCU WITH 8KB FRAM, 1KB SRAM, COMPARATOR, UART/SPI/I2C, TIMER

Find alt

Description

General part information

MSP430FR5722 Series

The TI MSP430FR572x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit ADC, a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

The TI MSP430FR572x family of ultra-low-power microcontrollers consists of multiple devices that feature embedded FRAM nonvolatile memory, ultra-low-power 16-bit MSP430™ CPU, and different peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Peripherals include a 10-bit ADC, a 16-channel comparator with voltage reference generation and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, an internal DMA, a hardware multiplier, an RTC, five 16-bit timers, and digital I/Os.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR5722IPW
ConnectivityUSART, I2C, SCI, IrDA, LINbus, UART, SPI
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O21
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package Length0.173 in
Package Name28-TSSOP
Package Width4.4 mm
PeripheralsWDT, PWM, Brown-out Detect, POR, Reset
Program Memory Depth8 K
Program Memory Size8 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth1 K
RAM Size Width8 bit
Speed8 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum2 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP430 System-Level ESD Considerations (Rev. B)
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
MSP Code Protection Features
Industrial Communications Solutions Featuring MSP Microcontrollers
Ultra-low power consumption MSP430FR57xx with FRAM memory
Benchmarking MCU power consumption for ultra-low-power applications
Crypto-Bootloader - Secure In-Field Firmware Updates for Ultra-Low Power MCUs
Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
MSP430 System ESD Troubleshooting Guide
MSP430FR57xx Family User's Guide (Rev. D)
MSP430 MCUs Development Guide Book (Rev. A)
Maximizing Write Speed on the MSP430™ FRAM (Rev. B)
Design Considerations When Using the MSP430 Graphics Library
MSP430FR572x Mixed-Signal Microcontrollers datasheet (Rev. C)
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)
Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers
FRAM FAQs
MSP430 FRAM Quality and Reliability (Rev. A)
Migrating from the USCI Module to the eUSCI Module (Rev. A)
Microcontrollers in Optical Networking
Power Management Solutions for Ultra-Low-Power 16-Bit MSP430 MCUs (Rev. D)
RF430FRL152H Novel Ferroelectric RAM Memory NFC Embedded Tag Based Sensors
System advantages of mixed signal integration
MSP430FR5722 Microcontroller Errata (Rev. AG)
ESD Diode Current Specification (Rev. B)
Low-Power FRAM Microcontrollers and Their Applications
Safety Manual for MSP430G2xx, F5xx, and FR57xx in IEC 60730 Safety Applications (Rev. A)