TFM-113-02-L-D-WT

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Samtec Inc.

2 TIN 1.27MM -55℃~+125℃ PHOSPHOR BRONZE VERTICAL WELDING SMD WIRE TO BOARD CONNECTOR ROHS

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TFM-113-02-L-D-WT

Active

Samtec Inc.

2 TIN 1.27MM -55℃~+125℃ PHOSPHOR BRONZE VERTICAL WELDING SMD WIRE TO BOARD CONNECTOR ROHS

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TFM-113-02-L-D-WT

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	15 µin
Contact Finish Thickness - Mating	0.38 µm
Contact Length - Mating	3.33 mm
Contact Length - Mating	0.131 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	2.9 A
Fastening Type	Push-Pull
Features	Solder Retention
Insulation Color	Black
Insulation Height	5.6 mm
Insulation Height	0.22 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	26
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Row Spacing - Mating	0.05 in
Row Spacing - Mating	1.27 mm
Shrouding	Shrouded - 4 Wall
Style	Board to Board, Cable
Termination	Solder
Voltage Rating	275 VAC

TFM-113 Series

Part	Pitch - Mating	Pitch - Mating	Insulation Height	Insulation Height	Current Rating (Amps)	Fastening Type	Contact Finish - Mating	Voltage Rating	Material Flammability Rating	Style	Number of Positions	Connector Type	Features	Number of Rows	Insulation Color	Row Spacing - Mating	Row Spacing - Mating	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions Loaded	Contact Length - Mating	Contact Length - Mating	Contact Material	Shrouding	Termination	Mounting Type	Contact Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Shape	Insulation Material	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. TFM-113-02-L-D-WT-K-TR	0.05 in	1.27 mm	5.6 mm	0.22 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header	Pick and Place Solder Retention	2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.33 mm	0.131 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Surface Mount	Male Pin	15 µin	0.38 µm	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-113-01-L-D	0.05 in	1.27 mm	5.6 mm	0.22 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header		2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.33 mm	0.131 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Through Hole	Male Pin	15 µin	0.38 µm	Square	Liquid Crystal Polymer (LCP)	0.078 in	1.98 mm
Samtec Inc. TFM-113-02-L-D-A-K-TR	0.05 in	1.27 mm	5.6 mm	0.22 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header	Board Guide Pick and Place	2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.33 mm	0.131 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Surface Mount	Male Pin	15 µin	0.38 µm	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-113-01-S-D-A	0.05 in	1.27 mm	5.6 mm	0.22 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header	Board Guide	2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.33 mm	0.131 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Through Hole	Male Pin	30 Áin	0.76 Ám	Square	Liquid Crystal Polymer (LCP)	0.078 in	1.98 mm
Samtec Inc. TFM-113-02-L-D-DS	0.05 in	1.27 mm	5.6 mm	0.22 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header	Mating Flange	2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.33 mm	0.131 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Surface Mount	Male Pin	15 µin	0.38 µm	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-113-02-S-DH-TR	0.05 in	1.27 mm	5.72 mm	0.225 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header		2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.81 mm	0.15 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Surface Mount Right Angle	Male Pin	30 Áin	0.76 Ám	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-113-02-S-DH	0.05 in	1.27 mm	5.72 mm	0.225 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header	Board Guide	2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.81 mm	0.15 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Surface Mount Right Angle	Male Pin	30 Áin	0.76 Ám	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-113-02-L-D-WT	0.05 in	1.27 mm	5.6 mm	0.22 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header	Solder Retention	2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.33 mm	0.131 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Surface Mount	Male Pin	15 µin	0.38 µm	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-113-02-S-D-A	0.05 in	1.27 mm	5.6 mm	0.22 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header	Board Guide	2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.33 mm	0.131 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Surface Mount	Male Pin	30 Áin	0.76 Ám	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. TFM-113-01-L-D-DS	0.05 in	1.27 mm	5.6 mm	0.22 in	2.9 A	Push-Pull	Gold	275 VAC	UL94 V-0	Board to Board Cable	26	Header	Mating Flange	2	Black	0.05 in	1.27 mm	Tin	-55 °C	125 °C	All	3.33 mm	0.131 in	Phosphor Bronze	Shrouded - 4 Wall	Solder	Through Hole	Male Pin	15 µin	0.38 µm	Square	Liquid Crystal Polymer (LCP)	0.078 in	1.98 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 6.21
LCSC	Piece	1	$ 17.22
		195	$ 6.87
		494	$ 6.64
		1001	$ 6.53

Description

General part information

TFM-113 Series

Connector Header Surface Mount 26 position 0.050" (1.27mm)

Documents

Technical documentation and resources

No documents available