TFM-113 Series

Catalog

CONN HEADER SMD 26POS 1.27MM

Part	Current Rating (Per Contact)	Pitch - Mating	Insulation Material	Connector Type	Material Flammability Rating	Style	Contact Type	Contact Finish Thickness - Mating	Contact Length - Mating	Number of Positions	Insulation Color	Features	Number of Positions Loaded	Insulation Height	Number of Rows	Operating Temperature (Max)	Operating Temperature (Min)	Fastening Type	Contact Material	Contact Shape	Termination	Contact Finish - Post	Mounting Type	Row Spacing - Mating	Shrouding	Voltage Rating	Contact Finish - Mating	Contact Length - Post
Samtec Inc. TFM-113-02-L-D-WT-K-TR	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	10 µin 15 µin	0.131 in	26	Black	Pick and Place Solder Retention	All	0.22 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Surface Mount	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold
Samtec Inc. TFM-113-01-L-D	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	10 µin 15 µin	0.131 in	26	Black		All	0.22 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Through Hole	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold	0.078 in
Samtec Inc. TFM-113-02-L-D-A-K-TR	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	10 µin 15 µin	0.131 in	26	Black	Board Guide Pick and Place	All	0.22 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Surface Mount	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold
Samtec Inc. TFM-113-01-S-D-A	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	30 µin	0.131 in	26	Black	Board Guide	All	0.22 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Through Hole	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold	0.078 in
Samtec Inc. TFM-113-02-L-D-DS	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	10 µin 15 µin	0.131 in	26	Black	Mating Flange	All	0.22 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Surface Mount	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold
Samtec Inc. TFM-113-02-S-DH-TR	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	30 µin	0.15 in	26	Black		All	0.225 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Right Angle Surface Mount	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold
Samtec Inc. TFM-113-02-S-DH	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	30 µin	0.15 in	26	Black	Board Guide	All	0.225 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Right Angle Surface Mount	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold
Samtec Inc. TFM-113-02-L-D-WT	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	10 µin 15 µin	0.131 in	26	Black	Solder Retention	All	0.22 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Surface Mount	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold
Samtec Inc. TFM-113-02-S-D-A	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	30 µin	0.131 in	26	Black	Board Guide	All	0.22 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Surface Mount	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold
Samtec Inc. TFM-113-01-L-D-DS	2.9 A 3.2 A 3.7 A	0.05 in	Liquid Crystal Polymer (LCP)	Header	UL94 V-0	Board Board or Cable	Male Pin	10 µin 15 µin	0.131 in	26	Black	Mating Flange	All	0.22 in	2	125 °C	-55 °C	Push-Pull	Phosphor Bronze	Square	Solder	Tin	Through Hole	0.05 in	Shrouded - 4 Wall	250 V 275 VAC	Gold	0.078 in