20-351000-10

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Aries Electronics

20P SOP PLUGIN IC / TRANSISTOR SOCKET

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Aries Electronics

20P SOP PLUGIN IC / TRANSISTOR SOCKET

Technical Specifications

Parameters and characteristics for this part

Specification	20-351000-10

Board Material	FR4 Epoxy Glass
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SSOP
Convert To (Adapter End)	0.3 in
Convert To (Adapter End)	DIP
Convert To (Adapter End)	7.62 mm
Mounting Type	Through Hole
Pitch - Mating	0.65 mm
Pitch - Mating	0.026 in
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in

Part	Contact Finish - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Pitch - Mating	Pitch - Mating	Board Material	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Convert From (Adapter End)	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Number of Positions	Proto Board Type	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	Size / Dimension [x]	Pitch [x]	Pitch [x]	Package Accepted	Board Thickness	Board Thickness	Board Thickness
Aries Electronics 20-351000-10	Tin-Lead	0.3 in	DIP	7.62 mm	0.65 mm	0.026 in	FR4 Epoxy Glass	Solder	200 µin	5.08 µm	Through Hole	SSOP	Brass	2.54 mm	0.1 in	3.18 mm	0.125 in
Aries Electronics 20-351000-11-RC																		20	SMD to DIP	10.16 mm	0.4 in	50.8 mm	2 in	0.026 in	0.65 mm	SSOP	0.062 in	0.0625 in	1.57 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly