TSM-115-03-G-DV

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Samtec Inc.

VERTICAL WELDING GOLD 30P -55℃~+125℃ 2.54MM DOUBLE ROW BLACK PHOSPHOR BRONZE 2.54MM SMD,P=2.54MM PIN HEADERS ROHS

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TSM-115-03-G-DV

Active

Samtec Inc.

VERTICAL WELDING GOLD 30P -55℃~+125℃ 2.54MM DOUBLE ROW BLACK PHOSPHOR BRONZE 2.54MM SMD,P=2.54MM PIN HEADERS ROHS

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TSM-115-03-G-DV

Connector Type	Cuttable, Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	0.42 in
Contact Length - Mating	10.67 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	30
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

TSM-115 Series

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Part	Contact Finish - Post	Style	Insulation Height	Insulation Height	Contact Material	Termination	Fastening Type	Shrouding	Contact Type	Material Flammability Rating	Insulation Material	Pitch - Mating	Pitch - Mating	Insulation Color	Number of Positions	Contact Shape	Connector Type	Number of Positions Loaded	Mounting Type	Contact Length - Mating [x]	Contact Length - Mating	Features	Number of Rows	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Finish - Mating	Contact Length - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions Loaded
Samtec Inc. TSM-115-01-T-SH-A-P	Tin	Board to Board Cable	3.05 mm	0.12 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	15	Square	Header	All	Surface Mount Right Angle	0.23 in	5.84 mm	Board Guide Pick and Place	1	105 ░C	-55 °C
Samtec Inc. TSM-115-01-F-DH-P	Tin	Board to Board Cable	6.1 mm	0.24 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	30	Square	Header	All	Surface Mount Right Angle	0.23 in	5.84 mm	Pick and Place	2	125 °C	-55 °C	3 µin	0.076 µm	2.54 mm	0.1 in	Gold
Samtec Inc. TSM-115-03-G-DV	Gold	Board to Board Cable	2.54 mm	0.1 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	30	Square	Cuttable Header	All	Surface Mount		10.67 mm		2	125 °C	-55 °C	10 çin	0.25 çm	2.54 mm	0.1 in	Gold	0.42 in	3 µin	0.076 µm
Samtec Inc. TSM-115-01-L-SV-007-P	Tin	Board to Board Cable	2.54 mm	0.1 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	15	Square	Cuttable Header		Surface Mount	0.23 in	5.84 mm	Pick and Place	1	125 °C	-55 °C	10 çin	0.25 çm			Gold				14
Samtec Inc. TSM-115-01-LM-DV-P-TR	Tin	Board to Board Cable	2.54 mm	0.1 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	30	Square	Cuttable Header	All	Surface Mount	0.23 in	5.84 mm	Pick and Place	2	125 °C	-55 °C	10 çin	0.25 çm	2.54 mm	0.1 in	Gold
Samtec Inc. TSM-115-01-L-SH-K-TR	Tin	Board to Board Cable	3.05 mm	0.12 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	15	Square	Header	All	Surface Mount Right Angle	0.23 in	5.84 mm	Pick and Place	1	125 °C	-55 °C	10 çin	0.25 çm			Gold
Samtec Inc. TSM-115-01-L-SV-P-TR	Tin	Board to Board Cable	2.54 mm	0.1 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	15	Square	Cuttable Header	All	Surface Mount	0.23 in	5.84 mm	Pick and Place	1	125 °C	-55 °C	10 çin	0.25 çm			Gold
Samtec Inc. TSM-115-03-S-DV	Tin	Board to Board Cable	2.54 mm	0.1 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	30	Square	Cuttable Header	All	Surface Mount		10.67 mm		2	125 °C	-55 °C	30 Áin	0.76 Ám	2.54 mm	0.1 in	Gold	0.42 in
Samtec Inc. TSM-115-02-S-SV-P-TR	Tin	Board to Board Cable	2.54 mm	0.1 in	Phosphor Bronze	Solder	Push-Pull	Unshrouded	Male Pin	UL94 V-0	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	15	Square	Cuttable Header	All	Surface Mount		8.13 mm	Pick and Place	1	125 °C	-55 °C	30 Áin	0.76 Ám			Gold	0.32 in
Samtec Inc. TSM-115-04-T-SH

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 4.29
LCSC	Piece	1	$ 11.90
		200	$ 4.75
		500	$ 4.59
		1000	$ 4.51

Description

General part information

TSM-115 Series

Connector Header Surface Mount 30 position 0.100" (2.54mm)

Documents

Technical documentation and resources