CONN HEADER SMD R/A 15POS 2.54MM
| Part | Contact Finish - Post | Style | Insulation Height | Insulation Height | Contact Material | Termination | Fastening Type | Shrouding | Contact Type | Material Flammability Rating | Insulation Material | Pitch - Mating | Pitch - Mating | Insulation Color | Number of Positions | Contact Shape | Connector Type | Number of Positions Loaded | Mounting Type | Contact Length - Mating [x] | Contact Length - Mating | Features | Number of Rows | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Finish - Mating | Contact Length - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Tin | Board to Board Cable | 3.05 mm | 0.12 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 15 | Square | Header | All | Surface Mount Right Angle | 0.23 in | 5.84 mm | Board Guide Pick and Place | 1 | 105 ░C | -55 °C | |||||||||
Samtec Inc. | Tin | Board to Board Cable | 6.1 mm | 0.24 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 30 | Square | Header | All | Surface Mount Right Angle | 0.23 in | 5.84 mm | Pick and Place | 2 | 125 °C | -55 °C | 3 µin | 0.076 µm | 2.54 mm | 0.1 in | Gold | ||||
Samtec Inc. | Gold | Board to Board Cable | 2.54 mm | 0.1 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 30 | Square | Cuttable Header | All | Surface Mount | 10.67 mm | 2 | 125 °C | -55 °C | 10 çin | 0.25 çm | 2.54 mm | 0.1 in | Gold | 0.42 in | 3 µin | 0.076 µm | |||
Samtec Inc. | Tin | Board to Board Cable | 2.54 mm | 0.1 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 15 | Square | Cuttable Header | Surface Mount | 0.23 in | 5.84 mm | Pick and Place | 1 | 125 °C | -55 °C | 10 çin | 0.25 çm | Gold | 14 | ||||||
Samtec Inc. | Tin | Board to Board Cable | 2.54 mm | 0.1 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 30 | Square | Cuttable Header | All | Surface Mount | 0.23 in | 5.84 mm | Pick and Place | 2 | 125 °C | -55 °C | 10 çin | 0.25 çm | 2.54 mm | 0.1 in | Gold | ||||
Samtec Inc. | Tin | Board to Board Cable | 3.05 mm | 0.12 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 15 | Square | Header | All | Surface Mount Right Angle | 0.23 in | 5.84 mm | Pick and Place | 1 | 125 °C | -55 °C | 10 çin | 0.25 çm | Gold | ||||||
Samtec Inc. | Tin | Board to Board Cable | 2.54 mm | 0.1 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 15 | Square | Cuttable Header | All | Surface Mount | 0.23 in | 5.84 mm | Pick and Place | 1 | 125 °C | -55 °C | 10 çin | 0.25 çm | Gold | ||||||
Samtec Inc. | Tin | Board to Board Cable | 2.54 mm | 0.1 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 30 | Square | Cuttable Header | All | Surface Mount | 10.67 mm | 2 | 125 °C | -55 °C | 30 Áin | 0.76 Ám | 2.54 mm | 0.1 in | Gold | 0.42 in | |||||
Samtec Inc. | Tin | Board to Board Cable | 2.54 mm | 0.1 in | Phosphor Bronze | Solder | Push-Pull | Unshrouded | Male Pin | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | Black | 15 | Square | Cuttable Header | All | Surface Mount | 8.13 mm | Pick and Place | 1 | 125 °C | -55 °C | 30 Áin | 0.76 Ám | Gold | 0.32 in | ||||||
Samtec Inc. |