FI-XB30SSRL-HF16

Obsolete

JAE Electronics

CONN RCPT 30P 0.039 GOLD SMD R/A

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FI-XB30SSRL-HF16

Obsolete

JAE Electronics

CONN RCPT 30P 0.039 GOLD SMD R/A

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	FI-XB30SSRL-HF16

Applications	General Purpose
Connector Type	Receptacle
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.099 µm
Contact Finish Thickness - Mating	3.9 µin
Contact Material	Copper Alloy
Contact Type	Non-Gendered
Current Rating (Amps)	1 A
Fastening Type	Friction Lock
Features	Shielded, Grounding Pins, Solder Retention
Insulation Color	Black
Insulation Material	Plastic
Material Flammability Rating	UL94 V-0
Mounting Type	Bottom Mount, Right Angle, Reverse Mount, Surface Mount, Board Cutout
Number of Positions	30
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	80 C
Operating Temperature [Min]	-40 °C
Pitch - Mating	0.039 in
Pitch - Mating	1 mm
Style	Board to Cable/Wire
Termination	Solder
Voltage Rating	200 V

FI-XB30 Series

Part	Contact Type	Features	Connector Type	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions Loaded	Current Rating (Amps)	Contact Material	Voltage Rating	Contact Finish - Mating	Mounting Type	Style	Termination	Number of Rows	Insulation Material	Number of Positions	Contact Finish - Post	Applications	Insulation Color	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Fastening Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	For Use With/Related Products
JAE Electronics FI-XB30SSRL-HF16	Non-Gendered	Grounding Pins Shielded Solder Retention	Receptacle	-40 °C	80 C	All	1 A	Copper Alloy	200 V	Gold	Board Cutout Bottom Mount Reverse Mount Right Angle Surface Mount	Board to Cable/Wire	Solder	1	Plastic	30	Tin	General Purpose	Black	UL94 V-0	0.039 in	1 mm	Friction Lock	0.099 µm	3.9 µin
JAE Electronics FI-XB30SSRLA-HF16	Non-Gendered	Grounding Pins Shielded Solder Retention	Receptacle	-40 °C	80 C	All	1 A	Copper Alloy	200 V	Gold	Board Cutout Bottom Mount Reverse Mount Right Angle Surface Mount	Board to Cable/Wire	Solder	1	Plastic	30	Tin	General Purpose	Black	UL94 V-0	0.039 in	1 mm	Friction Lock	0.099 µm	3.9 µin
JAE Electronics FI-XB30SRL-HF11-SP																30										FI-X Series
JAE Electronics FI-XB30SSL-HF15	Non-Gendered	Grounding Pins Shielded Solder Retention	Receptacle	-40 °C	80 C	All	1 A	Copper Alloy	200 V	Gold	Board Cutout Bottom Mount Right Angle Surface Mount	Board to Cable/Wire	Solder	1	Plastic	30	Tin	General Purpose	Beige	UL94 V-0	0.039 in	1 mm	Friction Lock	0.099 µm	3.9 µin
JAE Electronics FI-XB30SSLA-HF15	Non-Gendered	Grounding Pins Shielded Solder Retention	Receptacle	-40 °C	80 C	All	1 A	Copper Alloy	200 V	Gold	Board Cutout Bottom Mount Right Angle Surface Mount	Board to Cable/Wire	Solder	1	Plastic	30	Tin	General Purpose	Beige	UL94 V-0	0.039 in	1 mm	Friction Lock	0.099 µm	3.9 µin
JAE Electronics FI-XB30SL-HF10-R3000	Non-Gendered	Grounding Pins Shielded Solder Retention	Receptacle	-40 °C	80 C	All	1 A	Copper Alloy	200 V	Gold	Board Cutout Bottom Mount Right Angle Surface Mount	Board to Cable/Wire	Solder	1	Plastic	30	Tin	General Purpose	Beige	UL94 V-0	0.039 in	1 mm	Friction Lock	0.3 µm	12 µin
JAE Electronics FI-XB30SL-HF10
JAE Electronics FI-XB30S-HF10-NPB	Non-Gendered	Grounding Pins Shielded Solder Retention	Receptacle	-40 °C	80 C	All	1 A	Copper Alloy	200 V	Gold	Board Cutout Bottom Mount Right Angle Surface Mount	Board to Cable/Wire	Solder	1	Plastic	30	Tin	General Purpose	Beige	UL94 V-0	0.039 in	1 mm	Friction Lock

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

FI-XB30 Series

30 Position Receptacle Connector 0.039" (1.00mm) Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount Gold

Documents

Technical documentation and resources