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FI-XB30SSLA-HF15 - FI-XB30SSLA-HF15

FI-XB30SSLA-HF15

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JAE Electronics

CONN RCPT 30P 0.039 GOLD SMD R/A

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FI-XB30SSLA-HF15 - FI-XB30SSLA-HF15

FI-XB30SSLA-HF15

Active
JAE Electronics

CONN RCPT 30P 0.039 GOLD SMD R/A

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationFI-XB30SSLA-HF15
ApplicationsGeneral Purpose
Connector TypeReceptacle
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating0.099 µm
Contact Finish Thickness - Mating3.9 µin
Contact MaterialCopper Alloy
Contact TypeNon-Gendered
Current Rating (Amps)1 A
Fastening TypeFriction Lock
FeaturesShielded, Grounding Pins, Solder Retention
Insulation ColorBeige
Insulation MaterialPlastic
Material Flammability RatingUL94 V-0
Mounting TypeSurface Mount, Right Angle, Bottom Mount, Board Cutout
Number of Positions30
Number of Positions LoadedAll
Number of Rows1
Operating Temperature [Max]80 C
Operating Temperature [Min]-40 °C
Pitch - Mating0.039 in
Pitch - Mating1 mm
StyleBoard to Cable/Wire
TerminationSolder
Voltage Rating200 V

FI-XB30 Series

PartContact TypeFeaturesConnector TypeOperating Temperature [Min]Operating Temperature [Max]Number of Positions LoadedCurrent Rating (Amps)Contact MaterialVoltage RatingContact Finish - MatingMounting TypeStyleTerminationNumber of RowsInsulation MaterialNumber of PositionsContact Finish - PostApplicationsInsulation ColorMaterial Flammability RatingPitch - MatingPitch - MatingFastening TypeContact Finish Thickness - MatingContact Finish Thickness - MatingFor Use With/Related Products
JAE Electronics
Non-Gendered
Grounding Pins
Shielded
Solder Retention
Receptacle
-40 °C
80 C
All
1 A
Copper Alloy
200 V
Gold
Board Cutout
Bottom Mount
Reverse Mount
Right Angle
Surface Mount
Board to Cable/Wire
Solder
1
Plastic
30
Tin
General Purpose
Black
UL94 V-0
0.039 in
1 mm
Friction Lock
0.099 µm
3.9 µin
JAE Electronics
Non-Gendered
Grounding Pins
Shielded
Solder Retention
Receptacle
-40 °C
80 C
All
1 A
Copper Alloy
200 V
Gold
Board Cutout
Bottom Mount
Reverse Mount
Right Angle
Surface Mount
Board to Cable/Wire
Solder
1
Plastic
30
Tin
General Purpose
Black
UL94 V-0
0.039 in
1 mm
Friction Lock
0.099 µm
3.9 µin
JAE Electronics
30
FI-X Series
JAE Electronics
Non-Gendered
Grounding Pins
Shielded
Solder Retention
Receptacle
-40 °C
80 C
All
1 A
Copper Alloy
200 V
Gold
Board Cutout
Bottom Mount
Right Angle
Surface Mount
Board to Cable/Wire
Solder
1
Plastic
30
Tin
General Purpose
Beige
UL94 V-0
0.039 in
1 mm
Friction Lock
0.099 µm
3.9 µin
JAE Electronics
Non-Gendered
Grounding Pins
Shielded
Solder Retention
Receptacle
-40 °C
80 C
All
1 A
Copper Alloy
200 V
Gold
Board Cutout
Bottom Mount
Right Angle
Surface Mount
Board to Cable/Wire
Solder
1
Plastic
30
Tin
General Purpose
Beige
UL94 V-0
0.039 in
1 mm
Friction Lock
0.099 µm
3.9 µin
JAE Electronics
Non-Gendered
Grounding Pins
Shielded
Solder Retention
Receptacle
-40 °C
80 C
All
1 A
Copper Alloy
200 V
Gold
Board Cutout
Bottom Mount
Right Angle
Surface Mount
Board to Cable/Wire
Solder
1
Plastic
30
Tin
General Purpose
Beige
UL94 V-0
0.039 in
1 mm
Friction Lock
0.3 µm
12 µin
JAE Electronics
JAE Electronics
Non-Gendered
Grounding Pins
Shielded
Solder Retention
Receptacle
-40 °C
80 C
All
1 A
Copper Alloy
200 V
Gold
Board Cutout
Bottom Mount
Right Angle
Surface Mount
Board to Cable/Wire
Solder
1
Plastic
30
Tin
General Purpose
Beige
UL94 V-0
0.039 in
1 mm
Friction Lock

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 21.39
10$ 16.48
Digi-Reel® 1$ 21.39
10$ 16.48
Tape & Reel (TR) 120$ 12.66

Description

General part information

FI-XB30 Series

30 Position Receptacle Connector 0.039" (1.00mm) Board Cutout, Bottom Mount, Surface Mount, Right Angle Gold

Documents

Technical documentation and resources