
NCSWLF.015 1LB
ActiveChip Quik Inc.
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet

NCSWLF.015 1LB
ActiveChip Quik Inc.
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | NCSWLF.015 1LB | 
|---|---|
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 
| Diameter [diameter] | 0.015 in | 
| Diameter [diameter] | 0.38 mm | 
| Flux Type | No-Clean | 
| Form | 16 oz | 
| Form | 1 lb | 
| Form | Spool | 
| Melting Point [Max] [custom] | 220 °C | 
| Melting Point [Max] [custom] | 428 °F | 
| Melting Point [Min] [custom] | 423 °F | 
| Melting Point [Min] [custom] | 217 °C | 
| Type | Wire Solder | 
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 70.14 | |
| 5 | $ 66.75 | |||
Description
General part information
NCSW Series
No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (453.592g)
Documents
Technical documentation and resources