
NCSWLF.015 1LB
ActiveChip Quik Inc.
SOLDER LF SOLDER WIRE 96.5/3/0.5 TIN/SILVER/COPPER NO-CLEAN .015 1LB

NCSWLF.015 1LB
ActiveChip Quik Inc.
SOLDER LF SOLDER WIRE 96.5/3/0.5 TIN/SILVER/COPPER NO-CLEAN .015 1LB
Description
General part information
NCSW Series
No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (453.592g)
Technical Specifications
Parameters and characteristics for this part
| Specification | NCSWLF.015 1LB |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Diameter | 0.015 in |
| Form | Spool |
| Form Weight | 1 lb |
| Melting Point (Max) | 428 °F |
| Melting Point (Min) | 423 °F |
| Sn Composition | 96.5 % |
| Type | Wire Solder |
Pricing
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CAD
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