TC399XP256F300SBDKXUMA2

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Infineon Technologies

SAK-TC399XP-256F300S BD IS AURIX™ MCU WITH 6 CORES AT 300 MHZ, 16 MB FLASH, 2.9 MB SRAM, AND ISO 26262 COMPLIANT. FIND DATA SHEET, PARAMETERS AND ORDERING INFO

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TC399XP256F300SBDKXUMA2

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Infineon Technologies

SAK-TC399XP-256F300S BD IS AURIX™ MCU WITH 6 CORES AT 300 MHZ, 16 MB FLASH, 2.9 MB SRAM, AND ISO 26262 COMPLIANT. FIND DATA SHEET, PARAMETERS AND ORDERING INFO

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TC399XP256F300SBDKXUMA2

Connectivity	Ethernet, ASC, QSPI, LINbus, SENT, I2C, CANbus, MSC, FlexRay, PSI5, HSSL
Core Size	32 Bit, 10 Core
EEPROM Size	1 M
Mounting Type	Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	516-LFBGA
Peripherals	LVDS, WDT, DMA, PWM
Program Memory Size	16 MB
Program Memory Type	FLASH
RAM Size	2.47 M
Speed	300 MHz
Supplier Device Package	PG-LFBGA-516-10
Voltage - Supply (Vcc/Vdd) [Max]	5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	2.97 V

TC399XP256 Series

Part	Voltage - Supply (Vcc/Vdd)	Speed	Connectivity	Core Size [custom]	Core Size [custom]	Peripherals	Program Memory Type	Data Converters	Operating Temperature [Min]	Operating Temperature [Max]	Oscillator Type	Program Memory Size	Supplier Device Package	Mounting Type	Package / Case	RAM Size	Core Size	EEPROM Size	Voltage - Supply (Vcc/Vdd) [Max]	Voltage - Supply (Vcc/Vdd) [Min]
Infineon Technologies TC399XP256F300SBCKXUMA1	3.3 V 5 V	300 MHz	ASC CANbus Ethernet FlexRay HSSL I2C LINbus MSC PSI QSPI SENT	32-Bit	6-Core	DMA WDT	FLASH	12 b 100	-40 °C	125 °C	Internal	16 MB	PG-LFBGA-516-5	Surface Mount	516-LFBGA	2.75 K
Infineon Technologies TC399XP256F300SBDKXUMA2		300 MHz	ASC CANbus Ethernet FlexRay HSSL I2C LINbus MSC PSI5 QSPI SENT			DMA LVDS PWM WDT	FLASH		-40 °C	125 °C	Internal	16 MB	PG-LFBGA-516-10	Surface Mount	516-LFBGA	2.47 M	10 Core 32 Bit	1 M	5.5 V	2.97 V
Infineon Technologies TC399XP256F300SBDLXUMA2		300 MHz	ASC CANbus Ethernet FlexRay HSSL I2C LINbus MSC PSI5 QSPI SENT			DMA LVDS PWM WDT	FLASH		-40 °C	150 °C	Internal	16 MB	PG-LFBGA-516-10	Surface Mount	516-LFBGA	2.47 M	10 Core 32 Bit	1 M	5.5 V	2.97 V
Infineon Technologies TC399XP256F300SBCLXUMA1	3.3 V 5 V	300 MHz	ASC CANbus Ethernet FlexRay HSSL I2C LINbus MSC PSI QSPI SENT	32-Bit	6-Core	DMA I2S LVDS PWM WDT	FLASH		-40 °C	150 °C	Internal	16 MB	PG-LFBGA-516-10	Surface Mount	516-LFBGA	2.75 K

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	500	$ 111.87
Newark	Each (Supplied on Cut Tape)	1	$ 84.08
		10	$ 70.00
		25	$ 66.48
		50	$ 64.54
		100	$ 62.62

Description

General part information

TC399XP256 Series

Infineon releases its second generation AURIX microcontroller in embedded flash 40 nm technology. It comes back with an increase in performance, memory sizes, connectivity and more scalability to address the new automotive trends and challenges. This family has more than 20 products to provide the most scalable portfolio of safety microcontroller. In terms of performance, the highest end productTC39xoffers 6 cores running at 300 MHz and up to 6.9 MBytes embedded RAM, and consuming below 2 W. Its mirrored embedded flash banks offers A/B swap capabilities.

Documents

Technical documentation and resources