614-93-318-41-001000

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Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 18POS GOLD

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614-93-318-41-001000

Active

Mill-Max Manufacturing Corp.

CONN IC DIP SOCKET 18POS GOLD

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	614-93-318-41-001000

Contact Finish - Mating	Gold
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass Alloy
Current Rating (Amps)	3 A
Features	Open Frame, Carrier
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	18
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.165 in
Termination Post Length	4.19 mm
Type	0.3 "
Type	7.62 mm
Type	DIP

614-93 Series

...

Part	Contact Material - Post	Termination Post Length	Termination Post Length	Mounting Type	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Contact Finish - Mating	Contact Material - Mating	Features	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Material Flammability Rating	Contact Resistance
Mill-Max Manufacturing Corp. 614-93-318-41-001000	Brass Alloy	0.165 in	4.19 mm	Through Hole	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	18	-55 °C	125 °C	3 A
Mill-Max Manufacturing Corp. 614-93-322-31-012000	Brass Alloy	0.136 in	3.45 mm	Through Hole	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	22	-55 °C	125 °C	3 A
Mill-Max Manufacturing Corp. 614-93-422-31-007000	Brass Alloy	0.146 in	3.71 mm	Through Hole	0.4 in	10.16 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	22	-55 °C	125 °C	3 A
Mill-Max Manufacturing Corp. 614-93-624-41-001000	Brass Alloy	0.165 in	4.19 mm	Through Hole	0.6 in	15.24 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	24	-55 °C	125 °C	3 A
Mill-Max Manufacturing Corp. 614-93-210-31-007000	Brass Alloy	0.146 in	3.71 mm	Through Hole	0.2 in	5.08 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm		-55 °C	125 °C	3 A	2 x 5	10
Mill-Max Manufacturing Corp. 614-93-624-31-002000	Brass Alloy	0.136 in	3.45 mm	Through Hole	0.6 in	15.24 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	24	-55 °C	125 °C	3 A			UL94 V-0	10 mOhm
Mill-Max Manufacturing Corp. 614-93-316-31-007000	Brass Alloy	0.146 in	3.71 mm	Through Hole	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	16	-55 °C	125 °C	3 A
Mill-Max Manufacturing Corp. 614-93-424-31-012000	Brass Alloy	0.136 in	3.45 mm	Through Hole	0.4 in	10.16 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	24	-55 °C	125 °C	3 A
Mill-Max Manufacturing Corp. 614-93-316-31-012000	Brass Alloy	0.136 in	3.45 mm	Through Hole	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	16	-55 °C	125 °C	3 A
Mill-Max Manufacturing Corp. 614-93-642-41-001000	Brass Alloy	0.165 in	4.19 mm	Through Hole	0.6 in	15.24 mm	DIP	2.54 mm	0.1 in	Tin-Lead	200 µin	5.08 µm	Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	30 Áin	0.76 Ám	Solder	Gold	Beryllium Copper	Carrier Open Frame	0.1 in	2.54 mm	42	-55 °C	125 °C	3 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	66	$ 16.40

Description

General part information

614-93 Series

18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available