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CONN IC DIP SOCKET 18POS GOLD
| Part | Contact Material - Post | Termination Post Length | Termination Post Length | Mounting Type | Type | Type | Type | Pitch - Post | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Finish - Mating | Contact Material - Mating | Features | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Operating Temperature [Min] | Operating Temperature [Max] | Current Rating (Amps) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Material Flammability Rating | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Mill-Max Manufacturing Corp. | Brass Alloy | 0.165 in | 4.19 mm | Through Hole | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 18 | -55 °C | 125 °C | 3 A | ||||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.136 in | 3.45 mm | Through Hole | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 22 | -55 °C | 125 °C | 3 A | ||||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.146 in | 3.71 mm | Through Hole | 0.4 in | 10.16 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 22 | -55 °C | 125 °C | 3 A | ||||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.165 in | 4.19 mm | Through Hole | 0.6 in | 15.24 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 24 | -55 °C | 125 °C | 3 A | ||||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.146 in | 3.71 mm | Through Hole | 0.2 in | 5.08 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | -55 °C | 125 °C | 3 A | 2 x 5 | 10 | |||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.136 in | 3.45 mm | Through Hole | 0.6 in | 15.24 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 24 | -55 °C | 125 °C | 3 A | UL94 V-0 | 10 mOhm | ||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.146 in | 3.71 mm | Through Hole | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 16 | -55 °C | 125 °C | 3 A | ||||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.136 in | 3.45 mm | Through Hole | 0.4 in | 10.16 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 24 | -55 °C | 125 °C | 3 A | ||||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.136 in | 3.45 mm | Through Hole | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 16 | -55 °C | 125 °C | 3 A | ||||
Mill-Max Manufacturing Corp. | Brass Alloy | 0.165 in | 4.19 mm | Through Hole | 0.6 in | 15.24 mm | DIP | 2.54 mm | 0.1 in | Tin-Lead | 200 µin | 5.08 µm | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 30 Áin | 0.76 Ám | Solder | Gold | Beryllium Copper | Carrier Open Frame | 0.1 in | 2.54 mm | 42 | -55 °C | 125 °C | 3 A |