
W66CP2NQUAHJ
ActiveWinbond Electronics
IC DRAM 4GBIT LVSTL 11 200WFBGA
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W66CP2NQUAHJ
ActiveWinbond Electronics
IC DRAM 4GBIT LVSTL 11 200WFBGA
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | W66CP2NQUAHJ | W66CP2 Series |
---|---|---|
Clock Frequency | 2.133 GHz | 2.133 GHz |
Memory Format | DRAM | DRAM |
Memory Organization | 128 M | 128 M |
Memory Size | 512 kb | 512 kb |
Memory Type | Volatile | Volatile |
Mounting Type | Surface Mount | Surface Mount |
Operating Temperature [Max] | 105 °C | 105 °C |
Operating Temperature [Min] | -40 °C | -40 °C |
Package / Case | 200-WFBGA | 200-WFBGA |
Supplier Device Package | 200-WFBGA (10x14.5) | 200-WFBGA (10x14.5) |
Technology | SDRAM - Mobile LPDDR4 | SDRAM - Mobile LPDDR4 |
Voltage - Supply [Max] | 1.95 V, 1.17 V | 1.17 - 1.95 V |
Voltage - Supply [Min] | 1.06 V, 1.7 V | 1.06 - 1.7 V |
Write Cycle Time - Word, Page | 18 ns | 18 ns |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Distributor | Package | Quantity | $ | |
---|---|---|---|---|
Digikey | Tray | 144 | $ 5.32 |
W66CP2 Series
IC DRAM 4GBIT LVSTL 11 200WFBGA
Part | Operating Temperature [Max] | Operating Temperature [Min] | Memory Format | Package / Case | Memory Organization | Clock Frequency | Memory Size | Write Cycle Time - Word, Page | Supplier Device Package | Memory Type | Technology | Mounting Type | Voltage - Supply [Min] | Voltage - Supply [Max] |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W66CP2NQUAFJ TR | 105 °C | -40 °C | DRAM | 200-WFBGA | 128 M | 2.133 GHz | 512 kb | 18 ns | 200-WFBGA (10x14.5) | Volatile | SDRAM - Mobile LPDDR4 | Surface Mount | 1.06 V, 1.7 V | 1.17 V, 1.95 V |
Winbond Electronics W66CP2NQUAHJ | 105 °C | -40 °C | DRAM | 200-WFBGA | 128 M | 2.133 GHz | 512 kb | 18 ns | 200-WFBGA (10x14.5) | Volatile | SDRAM - Mobile LPDDR4 | Surface Mount | 1.06 V, 1.7 V | 1.17 V, 1.95 V |
Winbond Electronics W66CP2NQUAFJ | 105 °C | -40 °C | DRAM | 200-WFBGA | 128 M | 2.133 GHz | 512 kb | 200-WFBGA (10x14.5) | Volatile | SDRAM - Mobile LPDDR4 | Surface Mount | 1.06 V, 1.7 V | 1.17 V, 1.95 V | |
Winbond Electronics W66CP2NQUAGJ | 105 °C | -40 °C | DRAM | 200-WFBGA | 128 M | 2.133 GHz | 512 kb | 18 ns | 200-WFBGA (10x14.5) | Volatile | SDRAM - Mobile LPDDR4 | Surface Mount | 1.06 V, 1.7 V | 1.17 V, 1.95 V |
Winbond Electronics W66CP2NQUAGJ TR | 105 °C | -40 °C | DRAM | 200-WFBGA | 128 M | 2.133 GHz | 512 kb | 18 ns | 200-WFBGA (10x14.5) | Volatile | SDRAM - Mobile LPDDR4 | Surface Mount | 1.06 V, 1.7 V | 1.17 V, 1.95 V |
Description
General part information
W66CP2 Series
SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)
Documents
Technical documentation and resources