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14-823-90C - Product Image

14-823-90C

Active
Aries Electronics

14P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET

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14-823-90C - Product Image

14-823-90C

Active
Aries Electronics

14P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

Specification14-823-90C
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesClosed Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Number of Positions or Pins (Grid)14
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.56 mm
Termination Post Length0.14 in
Type0.3 "
Type7.62 mm
TypeDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
Digikey- 62$ 7.77
LCSCPiece 1$ 16.51
204$ 6.59
493$ 6.37
1003$ 6.26

Description

General part information

14-823 Series

14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole, Right Angle, Horizontal

Documents

Technical documentation and resources

No documents available