Specification	MPC5553MZP132

A/D Channels	40 count
A/D Resolution (bits)	12 bit
Connectivity	EBI, EMI, CANbus, Ethernet, SCI, SPI
Core Configuration	Single-Core
Core Processor	e200z6
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	220
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	External
Package / Case	416-BBGA
Package Length	27 mm
Package Name	416-PBGA
Package Width	27 mm
Peripherals	DMA, POR, WDT, PWM
Program Memory Depth	1.5 M
Program Memory Size	1.5 MB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	64 K
RAM Size Width	8 bit
Speed	132 MHz
Voltage - Supply (Vcc/Vdd) Maximum	1.65 V
Voltage - Supply (Vcc/Vdd) Minimum	1.35 V

MPC5553 Series

Part	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	RAM Size Depth	RAM Size Width	Program Memory Size	Program Memory Depth	Program Memory Width	Core Processor	Package / Case	Core Size (Bit Width)	Peripherals	A/D Channels	A/D Resolution (bits)	Connectivity	Mounting Type	Package Width	Package Name	Package Length	Oscillator Type	Operating Temperature (Max)	Operating Temperature (Min)	Number of I/O	Speed	Program Memory Type	Core Configuration
NXP USA Inc. MPC5553MZQ132	1.35 V	1.65 V	64 K	8 bit	1.5 MB	1.5 M	8 bit	e200z6	324-BBGA	32 Bit	DMA POR PWM WDT	40 count	12 bit	CANbus EBI EMI Ethernet SCI SPI	Surface Mount	23 mm	324-PBGA	23 mm	External	125 °C	-40 °C	220	132 MHz	FLASH	Single-Core
NXP USA Inc. MPC5553MZP132	1.35 V	1.65 V	64 K	8 bit	1.5 MB	1.5 M	8 bit	e200z6	416-BBGA	32 Bit	DMA POR PWM WDT	40 count	12 bit	CANbus EBI EMI Ethernet SCI SPI	Surface Mount	27 mm	416-PBGA	27 mm	External	125 °C	-40 °C	220	132 MHz	FLASH	Single-Core
NXP USA Inc. MPC5553MVR132	1.35 V	1.65 V	64 K	8 bit	1.5 MB	1.5 M	8 bit	e200z6	416-BBGA	32 Bit	DMA POR PWM WDT	40 count	12 bit	CANbus EBI EMI Ethernet SCI SPI	Surface Mount	27 mm	416-PBGA	27 mm	External	125 °C	-40 °C	220	132 MHz	FLASH	Single-Core

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